Yeh; Chao Feng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yeh; Chao Feng.The latest application filed is for "surround gate vertical field effect transistors including tubular and strip electrodes and method of making the same".

Company Profile

4.7.5

Yeh; Chao Feng - Yokkaichi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Surround gate vertical field effect transistors including tubular and strip electrodes and method of making the same Grant 10,707,314 - Takaki , et al.	2020-07-07
Vertical transistors with sidewall gate air gaps and methods therefor Grant 10,355,129 - Yeh , et al. July 16, 2	2019-07-16
Array of hole-type surround gate vertical field effect transistors and method of making thereof Grant 10,290,681 - Yeh , et al.	2019-05-14
Surround Gate Vertical Field Effect Transistors Including Tubular And Strip Electrodes And Method Of Making The Same App 20190103467 - TAKAKI; Seje ; et al.	2019-04-04
Array Of Hole-type Surround Gate Vertical Field Effect Transistors And Method Of Making Thereof App 20190088717 - YEH; Chao Feng ; et al.	2019-03-21
Vertical transistors with sidewall gate air gaps and methods therefor Grant 10,115,820 - Yeh , et al. October 30, 2	2018-10-30
Vertical Transistors With Sidewall Gate Air Gaps And Methods Therefor App 20180301556 - Yeh; Chao Feng ; et al.	2018-10-18
Memory device containing wrap gate vertical select transistors and method of making thereof Grant 10,079,267 - Yeh , et al. September 18, 2	2018-09-18
Vertical Transistors With Sidewall Gate Air Gaps And Methods Therefor App 20180158947 - Yeh; Chao Feng ; et al.	2018-06-07
Method of forming crack free gap fill Grant 8,937,011 - Iuchi , et al. January 20, 2	2015-01-20
Method of inhibiting wire collapse Grant 8,802,561 - Yeh , et al. August 12, 2	2014-08-12
Method Of Forming Crack Free Gap Fill App 20140170847 - Iuchi; Hiroaki ; et al.	2014-06-19

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