| Patent | Date |
|---|
Integrated circuit (IC) chip comprising an identification circuit
Grant 9,941,886 - Xiao , et al. April 10, 2 | 2018-04-10 |
Integrated Circuit (ic) Chip Comprising An Identification Circuit
App 20170366185 - Xiao; Jimmy Yong ; et al. | 2017-12-21 |
Identification circuit and IC chip comprising the same
Grant 9,768,781 - Xiao , et al. September 19, 2 | 2017-09-19 |
Identification Circuit And Ic Chip Comprising The Same
App 20160301413 - Xiao; Jimmy Yong ; et al. | 2016-10-13 |
Self-propelled robotic device that moves through bodily and other passageways
Grant 8,303,484 - Hopper , et al. November 6, 2 | 2012-11-06 |
Semiconductor wafer and die that include an integrated circuit and two or more different MEMS-based semiconductor devices
Grant 8,288,834 - Padmanabhan , et al. October 16, 2 | 2012-10-16 |
Method of forming a semiconductor die with aluminum-spiked heat pipes
Grant 8,198,150 - Yegnashankaran June 12, 2 | 2012-06-12 |
Hydrophobic Solar Concentrator and Method of Using and Forming the Hydrophobic Solar Concentrator
App 20120067396 - Yegnashankaran; Visvamohan ; et al. | 2012-03-22 |
Cellular telephone handset with increased reception sensitivity and reduced transmit power levels
Grant 7,996,034 - Yegnashankaran , et al. August 9, 2 | 2011-08-09 |
Self-propelled Robotic Device That Moves Through Bodily And Other Passageways
App 20110118607 - Hopper; Peter J. ; et al. | 2011-05-19 |
Bipolar transistor and method of forming the bipolar transistor with a backside contact
Grant 7,863,644 - Yegnashankaran , et al. January 4, 2 | 2011-01-04 |
Method of forming a metal interconnect with capacitive structures that adjust the capacitance of the interconnect
Grant 7,790,602 - Yegnashankaran , et al. September 7, 2 | 2010-09-07 |
Power supply with reduced power consumption when a load is disconnected from the power supply
Grant 7,764,517 - Yegnashankaran , et al. July 27, 2 | 2010-07-27 |
Backside defect detector and method that determines whether unwanted materials are present on the backside of a semiconductor wafer
Grant 7,754,502 - Yegnashankaran July 13, 2 | 2010-07-13 |
Semiconductor die with an integrated inductor
Grant 7,705,421 - Yegnashankaran April 27, 2 | 2010-04-27 |
Semiconductor die with aluminum-spiked heat pipes
Grant 7,646,064 - Yegnashankaran January 12, 2 | 2010-01-12 |
MEMS semiconductor sensor device
Grant 7,633,131 - Padmanabhan , et al. December 15, 2 | 2009-12-15 |
Power supply with reduced power consumption when a load is disconnected from the power supply
App 20090116269 - Yegnashankaran; Visvamohan ; et al. | 2009-05-07 |
Method of forming a MOS transistor with a litho-less gate
Grant 7,482,228 - Padmanabhan , et al. January 27, 2 | 2009-01-27 |
Method of forming a semiconductor die with heat and electrical pipes
Grant 7,338,840 - Padmanabhan , et al. March 4, 2 | 2008-03-04 |
Method of selectively forming MEMS-based semiconductor devices at the end of a common fabrication process
Grant 7,329,555 - Padmanabhan , et al. February 12, 2 | 2008-02-12 |
Single-crystal silicon semiconductor structure
Grant 7,230,301 - Padmanabhan , et al. June 12, 2 | 2007-06-12 |
Semiconductor sensor device using MEMS technology
Grant 7,192,819 - Padmanabhan , et al. March 20, 2 | 2007-03-20 |
World-wide distributed testing for integrated circuits
Grant 7,188,044 - Yegnashankaran , et al. March 6, 2 | 2007-03-06 |
Method of forming a hermetic seal for silicon die with metal feed through structure
Grant 7,109,571 - Padmanabhan , et al. September 19, 2 | 2006-09-19 |
Method of forming a MOS transistor with a layer of silicon germanium carbon
Grant 7,098,095 - Naem , et al. August 29, 2 | 2006-08-29 |
Semiconductor die with heat and electrical pipes
Grant 7,075,133 - Padmanabhan , et al. July 11, 2 | 2006-07-11 |
Method of dicing a semiconductor wafer that substantially reduces the width of the saw street
Grant 7,052,977 - Yegnashankaran , et al. May 30, 2 | 2006-05-30 |
Multilevel metal interconnect and method of forming the interconnect with capacitive structures that adjust the capacitance of the interconnect
Grant 7,042,092 - Yegnashankaran , et al. May 9, 2 | 2006-05-09 |
Method of forming a vertical MOS transistor
Grant 6,949,421 - Padmanabhan , et al. September 27, 2 | 2005-09-27 |
Method of forming the integrated circuit having a die with high Q inductors and capacitors attached to a die with a circuit as a flip chip
Grant 6,946,321 - Yegnashankaran , et al. September 20, 2 | 2005-09-20 |
Apparatus and method for dicing semiconductor wafers
Grant 6,933,212 - Lee , et al. August 23, 2 | 2005-08-23 |
Convex image sensor and method of forming the sensor
Grant 6,881,943 - Yegnashankaran April 19, 2 | 2005-04-19 |
High Q inductor in multi-level interconnect
Grant 6,833,781 - Padmanabhan , et al. December 21, 2 | 2004-12-21 |
Integrated circuit and method of forming the integrated circuit having a die with high Q inductors and capacitors attached to a die with a circuit as a flip chip
Grant 6,781,239 - Yegnashankaran , et al. August 24, 2 | 2004-08-24 |
Vertical MOS transistor
Grant 6,777,288 - Padmanabhan , et al. August 17, 2 | 2004-08-17 |
Hermetic seal for silicon die with metal feed through structure
Grant 6,746,956 - Padmanabhan , et al. June 8, 2 | 2004-06-08 |
Radiation hardened MOS transistor
Grant 6,730,969 - Padmanabhan , et al. May 4, 2 | 2004-05-04 |
Deep submicron MOS transistor with increased threshold voltage
Grant 6,723,593 - Padmanabhan , et al. April 20, 2 | 2004-04-20 |
Silicon die with metal feed through structure
Grant 6,677,235 - Yegnashankaran , et al. January 13, 2 | 2004-01-13 |
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