Yeen; Chan Peng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yeen; Chan Peng.The latest application filed is for "die attach method and leadframe structure".

Company Profile

0.12.1

Yeen; Chan Peng - Melaka MY
Yeen; Chan Peng - Taman Malim Jaya MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Die attach method and leadframe structure Grant 7,859,090 - Bayan , et al. December 28, 2	2010-12-28
Die Attach Method And Leadframe Structure App 20090315161 - BAYAN; Jaime A. ; et al.	2009-12-24
Die attach method and microarray leadframe structure Grant 7,598,122 - Bayan , et al. October 6, 2	2009-10-06
Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package Grant 7,259,460 - Bayan , et al. August 21, 2	2007-08-21
Method of fabricating a micro-array integrated circuit package Grant 7,186,588 - Bayan , et al. March 6, 2	2007-03-06
Leadless leadframe packaging panel featuring peripheral dummy leads Grant 7,002,239 - Nadarajah , et al. February 21, 2	2006-02-21
Locking of mold compound to conductive substrate panels Grant 6,963,124 - Hong , et al. November 8, 2	2005-11-08
Leadless leadframe package design that provides a greater structural integrity Grant 6,933,174 - Hong , et al. August 23, 2	2005-08-23
Ultra-low loop wire bonding Grant 6,933,223 - Soon , et al. August 23, 2	2005-08-23
Leadless leadframe package design that provides a greater structural integrity Grant 6,818,970 - Hong , et al. November 16, 2	2004-11-16
Locking of mold compound to conductive substrate panels Grant 6,808,961 - Hong , et al. October 26, 2	2004-10-26
Leadless leadframe package design that provides a greater structural integrity Grant 6,677,667 - Hong , et al. January 13, 2	2004-01-13
Pin indicator for leadless leadframe packages Grant 6,448,107 - Hong , et al. September 10, 2	2002-09-10

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