Yee; Pak Hong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yee; Pak Hong.The latest application filed is for "optical transceiver with reduced height".

Company Profile

0.12.13

Yee; Pak Hong - Singapore SG
Yee; Pak Hong - Pandan Valley SG
Yee; Pak Hong - Pandan SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Touch input system using light guides Grant 8,130,210 - Saxena , et al. March 6, 2	2012-03-06
Optical transceiver with reduced height Grant 7,842,957 - Goh , et al. November 30, 2	2010-11-30
Intrinsic thermal enhancement for FBGA package Grant 7,521,794 - Yee , et al. April 21, 2	2009-04-21
Composite receiver assembly having a circuit board on which multiple receiver devices that operate on different sets of wavelengths are mounted Grant 7,514,666 - Yee , et al. April 7, 2	2009-04-07
Remote control receiver device and ambient light photosensor device incorporated into a single composite assembly Grant 7,495,204 - Zhang , et al. February 24, 2	2009-02-24
Intrinsic thermal enhancement for FBGA package Grant 7,459,346 - Yee , et al. December 2, 2	2008-12-02
Optical Transceiver with Reduced Height App 20080219673 - Goh; Teck Chai ; et al.	2008-09-11
Composite Assembly That Incorporates Multiple Devices That Use Different Wavelengths Of Light And Method For Making Same App 20080011939 - YEE; Pak Hong ; et al.	2008-01-17
Miniature Composite Assembly That Incorporates Multiple Devices That Use Different Wavelengths Of Light And Method For Making The Composite Assembly App 20080013961 - YEE; Pak Hong ; et al.	2008-01-17
Remote Control Receiver Device And Ambient Light Photosensor Device Incorporated Into A Single Composite Assembly App 20080011940 - Zhang; Jing ; et al.	2008-01-17
Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof Grant 7,285,971 - Yee , et al. October 23, 2	2007-10-23
Method and apparatus employing optical angle detectors adjacent an optical input area App 20070132742 - Chen; Deng-Peng ; et al.	2007-06-14
Intrinsic thermal enhancement for FBGA package App 20060289989 - Yee; Pak Hong ; et al.	2006-12-28
Intrinsic thermal enhancement for FBGA package Grant 7,138,711 - Yee , et al. November 21, 2	2006-11-21
Systems and methods for high resolution optical touch position systems App 20060132454 - Chen; Deng-Peng ; et al.	2006-06-22
Touch input system using light guides App 20060114244 - Saxena; Kuldeep Kumar ; et al.	2006-06-01
Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof Grant 7,030,640 - Yee , et al. April 18, 2	2006-04-18
Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof App 20050270051 - Yee, Pak Hong ; et al.	2005-12-08
Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof App 20050200376 - Yee, Pak Hong ; et al.	2005-09-15
Intrinsic thermal enhancement for FBGA package App 20050186704 - Yee, Pak Hong ; et al.	2005-08-25
Intrinsic thermal enhancement for FBGA package App 20030230799 - Yee, Pak Hong ; et al.	2003-12-18
Method for adhering and sealing a silicon chip in an integrated circuit package Grant 6,387,729 - Eng , et al. May 14, 2	2002-05-14
Integrated circuit package Grant 6,365,833 - Eng , et al. April 2, 2	2002-04-02
Method for adhering and sealing a silicon chip in an integrated circuit package App 20020001882 - Eng, Kian Teng ; et al.	2002-01-03
Method for adhering and sealing a silicon chip in an integrated circuit package Grant 6,087,203 - Eng , et al. July 11, 2	2000-07-11

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