Yee; Jae Hak

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yee; Jae Hak.The latest application filed is for "integrated circuit package system with stacked die".

Company Profile

0.41.28

Yee; Jae Hak - Singapore N/A SG
Yee; Jae Hak - Shanghai CN
Yee; Jae Hak - Seoul KR
Yee, Jae Hak - Mansion SG
Yee; Jae Hak - Sam-Kiang Mansion SG
Yee; Jae Hak - S.K. Mansion SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stackable multi-chip package system Grant 9,202,776 - Yee December 1, 2	2015-12-01
Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor Grant 8,946,878 - Chin , et al. February 3, 2	2015-02-03
Integrated circuit package system with molded strip protrusion Grant 8,937,372 - Yee , et al. January 20, 2	2015-01-20
Integrated circuit package system with leads having multiple sides exposed Grant 8,847,413 - Yee , et al. September 30, 2	2014-09-30
Integrated circuit package system with stacked die Grant 8,810,019 - Yee , et al. August 19, 2	2014-08-19
Integrated circuit packaging system with leadframe and method of manufacture thereof Grant 8,581,382 - Shen , et al. November 12, 2	2013-11-12
Method for manufacture of inline integrated circuit system Grant 8,501,540 - Yee , et al. August 6, 2	2013-08-06
Integrated circuit package system with L-shaped leadfingers Grant 8,471,374 - Kim , et al. June 25, 2	2013-06-25
Stackable multi-chip package system Grant 8,432,026 - Lee , et al. April 30, 2	2013-04-30
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 8,207,015 - Shen , et al. June 26, 2	2012-06-26
Integrated Circuit Package System With Stacked Die App 20120133038 - Yee; Jae Hak ; et al.	2012-05-31
Integrated circuit package system with stacked die Grant 8,138,591 - Yee , et al. March 20, 2	2012-03-20
Integrated Circuit Packaging System With Leadframe And Method Of Manufacture Thereof App 20110309530 - Shen; Guo Qiang ; et al.	2011-12-22
Integrated circuit package system for package stacking and manufacturing method thereof Grant 8,067,272 - Kim , et al. November 29, 2	2011-11-29
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20110266664 - Shen; Guo Qiang ; et al.	2011-11-03
Integrated Circuit Package Stacking System With Lead Overlap And Method Of Manufacture Thereof App 20110248391 - Jin; Wei Qiang ; et al.	2011-10-13
Method For Manufacture Of Inline Integrated Circuit System App 20110244635 - Yee; Jae Hak ; et al.	2011-10-06
Integrated circuit package system with stacked devices Grant 8,018,039 - Yee , et al. September 13, 2	2011-09-13
Inline integrated circuit system Grant 7,968,981 - Yee , et al. June 28, 2	2011-06-28
Stackable multi-chip package system with support structure Grant 7,915,738 - Kim , et al. March 29, 2	2011-03-29
Stackable Multi-chip Package System With Support Structure App 20100052117 - Kim; Young Cheol ; et al.	2010-03-04
Integrated Circuit Package System For Package Stacking And Manufacturing Method Thereof App 20100038768 - Kim; Young Cheol ; et al.	2010-02-18
Stackable multi-chip package system with support structure Grant 7,645,638 - Kim , et al. January 12, 2	2010-01-12
Integrated circuit package system for package stacking and manufacturing method thereof Grant 7,622,333 - Kim , et al. November 24, 2	2009-11-24
Inline Integrated Circuit System App 20090258494 - Yee; Jae Hak ; et al.	2009-10-15
Integrated Circuit Package System With Stacked Devices App 20090224389 - Yee; Jae Hak ; et al.	2009-09-10
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant Grant 7,564,122 - Yee , et al. July 21, 2	2009-07-21
Integrated Circuit Package-in-package System App 20090146271 - Chin; Chee Keong ; et al.	2009-06-11
Integrated Circuit Package System With Molded Strip Protrusion App 20080230883 - Yee; Jae Hak ; et al.	2008-09-25
Integrated Circuit Package System With Leads Having Multiple Sides Exposed App 20080171405 - Yee; Jae Hak ; et al.	2008-07-17
Integrated Circuit Package System With Stacked Die App 20080073770 - Yee; Jae Hak ; et al.	2008-03-27
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant App 20080036055 - Yee; Jae Hak ; et al.	2008-02-14
Stackable Multi-chip Package System App 20080029868 - Lee; Koo Hong ; et al.	2008-02-07
Stackable Multi-chip Package System App 20080029867 - Kim; Young Cheol ; et al.	2008-02-07
Stackable Multi-chip Package System With Support Structure App 20080029866 - Kim; Young Cheol ; et al.	2008-02-07
Stackable Multi-chip Package System App 20070278643 - Yee; Jae Hak	2007-12-06
Integrated Circuit Package System With L-shaped Leadfingers App 20070194463 - Kim; Young Cheol ; et al.	2007-08-23
Leadframe having lead locks to secure leads to encapsulant Grant 7,057,280 - Yee , et al. June 6, 2	2006-06-06
Semiconductor package Grant 6,953,988 - Seo , et al. October 11, 2	2005-10-11
Ground plane for exposed package Grant 6,876,069 - Punzalan , et al. April 5, 2	2005-04-05
Semiconductor package App 20050062148 - Seo, Seong Min ; et al.	2005-03-24
Semiconductor package Grant 6,858,919 - Seo , et al. February 22, 2	2005-02-22
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant Grant 6,825,062 - Yee , et al. November 30, 2	2004-11-30
Semiconductor package including stacked chips with aligned input/output pads Grant 6,759,737 - Seo , et al. July 6, 2	2004-07-06
Semiconductor package and method of making leadframe having lead locks to secure leads to encapsulant App 20040097016 - Yee, Jae Hak ; et al.	2004-05-20
Ground plane for exposed package App 20040070055 - Punzalan, Jeffrey D. ; et al.	2004-04-15
Thin and heat radiant semiconductor package and method for manufacturing App 20040061217 - Ku, Jae Hun ; et al.	2004-04-01
Method of trimming and singulating leaded semiconductor packages Grant 6,686,258 - Yee February 3, 2	2004-02-03
End grid array semiconductor package Grant 6,677,663 - Ku , et al. January 13, 2	2004-01-13
Thin and heat radiant semiconductor package and method for manufacturing Grant 6,646,339 - Ku , et al. November 11, 2	2003-11-11
Ground plane for exposed package Grant 6,630,373 - Punzalan , et al. October 7, 2	2003-10-07
Leadframe for semiconductor package and mold for molding the same Grant 6,627,976 - Chung , et al. September 30, 2	2003-09-30
Ground Plane For Exposed Package App 20030160309 - Punzalan, Jeffrey D. ; et al.	2003-08-28
Semiconductor device having increased moisture path and increased solder joint strength Grant 6,525,406 - Chung , et al. February 25, 2	2003-02-25
Plastic integrated circuit device package and method for making the package Grant 6,521,987 - Glenn , et al. February 18, 2	2003-02-18
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant App 20030020146 - Yee, Jae Hak ; et al.	2003-01-30
Leaded semiconductor packages and method of trimming such packages App 20030011006 - Yee, Jae Hak	2003-01-16
Semiconductor package including stacked chips App 20030001252 - Ku, Jae Hun ; et al.	2003-01-02
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant Grant 6,448,633 - Yee , et al. September 10, 2	2002-09-10
Semiconductor package App 20020020907 - Seo, Seong Min ; et al.	2002-02-21