Yee; Dennis Kwok-Wai
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yee; Dennis Kwok-Wai.The latest application filed is for "plating catalyst and method".
- Yee; Dennis Kwok-Wai - Yuen Long HK
- Yee; Dennis Kwok-Wai - Fanling CN
| Patent | Date |
|---|---|
| Plating catalyst and method Grant 10,066,299 - Kwong , et al. September 4, 2 | 2018-09-04 |
| Formaldehyde free electroless copper plating compositions and methods Grant 9,809,883 - Chow , et al. November 7, 2 | 2017-11-07 |
| Process for electroless plating and a solution used for the same Grant 9,783,890 - Yee , et al. October 10, 2 | 2017-10-10 |
| Plating Catalyst And Method App 20170152600 - KWONG; SUK KWAN ; et al. | 2017-06-01 |
| Formaldehyde free electroless copper plating compositions and methods Grant 9,611,550 - Chow , et al. April 4, 2 | 2017-04-04 |
| Process for electroless plating and a solution used for the same Grant 9,499,910 - Yee , et al. November 22, 2 | 2016-11-22 |
| Plating catalyst and method Grant 9,227,182 - Zhou , et al. January 5, 2 | 2016-01-05 |
| Formaldehyde Free Electroless Copper Plating Compositions And Methods App 20150376795 - Chow; Andy Lok-Fung ; et al. | 2015-12-31 |
| Process For Electroless Plating And A Solution Used For The Same App 20150322574 - YEE; Dennis Kwok-Wai ; et al. | 2015-11-12 |
| Plating catalyst and method Grant 9,149,798 - Zhou , et al. October 6, 2 | 2015-10-06 |
| Plating Catalyst And Method App 20140242287 - KWONG; Suk Kwan ; et al. | 2014-08-28 |
| Formaldehyde Free Electroless Copper Plating Compositions And Methods App 20140178572 - CHOW; Andy Lok-Fung ; et al. | 2014-06-26 |
| Process For Electroless Plating And A Solution Used For The Same App 20140120263 - YEE; Dennis Kwok-Wai ; et al. | 2014-05-01 |
| Plating Catalyst And Method App 20130171366 - ZHOU; Wenjia ; et al. | 2013-07-04 |
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