Yean; Tay Wuu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yean; Tay Wuu.The latest application filed is for "pre-encapsulated cavity interposer".

Company Profile

0.14.15

Yean; Tay Wuu - Singapore N/A SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages Grant 8,399,297 - Yean , et al. March 19, 2	2013-03-19
Pre-encapsulated Cavity Interposer App 20120034740 - Yean; Tay Wuu ; et al.	2012-02-09
Pre-encapsulated cavity interposer Grant 8,072,082 - Yean , et al. December 6, 2	2011-12-06
Microelectronic Die Packages With Leadframes, Including Leadframe-based Interposer For Stacked Die Packages, And Associated Systems And Methods App 20110215453 - Eng; Meow Koon ; et al.	2011-09-08
Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods Grant 7,947,529 - Koon , et al. May 24, 2	2011-05-24
Pre-encapsulated Cavity Interposer App 20090267171 - Yean; Tay Wuu ; et al.	2009-10-29
Semiconductor device assemblies and packages including multiple semiconductor device components Grant 7,573,136 - Jiang , et al. August 11, 2	2009-08-11
Microelectronic Die Packages With Leadframes, Including Leadframe-based Interposer For Stacked Die Packages, And Associated Systems And Methods App 20090045489 - Koon; Eng Meow ; et al.	2009-02-19
Microelectronic devices and methods for packaging microelectronic devices App 20070128737 - Yean; Tay Wuu ; et al.	2007-06-07
Methods for assembling multiple semiconductor devices Grant 7,198,980 - Jiang , et al. April 3, 2	2007-04-03
Microelectronic devices Grant 7,145,228 - Yean , et al. December 5, 2	2006-12-05
Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers Grant 7,112,876 - Fee , et al. September 26, 2	2006-09-26
Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers App 20060006513 - Fee; Setho Sing ; et al.	2006-01-12
Microelectronic devices and methods for packaging microelectronic devices App 20060006534 - Yean; Tay Wuu ; et al.	2006-01-12
Semiconductor device assemblies and packages including multiple semiconductor device components App 20050218518 - Jiang, Tongbi ; et al.	2005-10-06
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate Grant 6,951,777 - Fee , et al. October 4, 2	2005-10-04
Methods for packaging microelectronic devices Grant 6,946,325 - Yean , et al. September 20, 2	2005-09-20
Temporary, conformable contacts for microelectronic components Grant 6,913,476 - Yean , et al. July 5, 2	2005-07-05
Semiconductor device assemblies and packages including multiple semiconductor devices and methods Grant 6,906,415 - Jiang , et al. June 14, 2	2005-06-14
Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembled Grant 6,870,247 - Fee , et al. March 22, 2	2005-03-22
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate App 20040203191 - Fee, Setho Sing ; et al.	2004-10-14
Microelectronic devices and methods for packaging microelectronic devices App 20040178495 - Yean, Tay Wuu ; et al.	2004-09-16
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate Grant 6,773,960 - Fee , et al. August 10, 2	2004-08-10
Methods for assembling multiple semiconductor devices App 20040106229 - Jiang, Tongbi ; et al.	2004-06-03
Temporary, Conformable Contacts For Microelectronic Components App 20040029425 - Yean, Tay Wuu ; et al.	2004-02-12
Semiconductor device assemblies and packages including multiple semiconductor devices and methods App 20030230801 - Jiang, Tongbi ; et al.	2003-12-18
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate App 20030176045 - Fee, Setho Sing ; et al.	2003-09-18
Interposer, packages including the interposer, and methods App 20020167092 - Fee, Setho Sing ; et al.	2002-11-14

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