Yean; Chiou Jun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yean; Chiou Jun.The latest application filed is for "device arrangement structure assembly".
- Yean; Chiou Jun - Jhudong Township TW
- Yean; Chiou Jun - Taichung City TW
| Patent | Date |
|---|---|
| Device arrangement structure assembly having adhesive tape layer Grant 11,024,552 - Liao , et al. June 1, 2 | 2021-06-01 |
| Device Arrangement Structure Assembly App 20200152526 - LIAO; Chun Hao ; et al. | 2020-05-14 |
| Device arrangement structure assembly and test method Grant 10,535,572 - Liao , et al. Ja | 2020-01-14 |
| Device Arrangement Structure Assembly And Test Method App 20170301659 - LIAO; Chun Hao ; et al. | 2017-10-19 |
| Method and monitor structure for detecting and locating IC defects App 20070020778 - Yi; Cheng Wen ; et al. | 2007-01-25 |
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