Ye; Seng Kim

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ye; Seng Kim.The latest application filed is for "systems and methods for reducing the size of a semiconductor assembly".

Company Profile

7.13.18

Ye; Seng Kim - Singapore SG
Ye; Seng Kim - Fernvale Close SG
- Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Systems And Methods For Reducing The Size Of A Semiconductor Assembly App 20220208744 - Ng; Hong Wan ; et al.	2022-06-30
Integrated Circuit Wire Bonded To A Multi-layer Substrate Having An Open Area That Exposes Wire Bond Pads At A Surface Of The Inner Layer App 20220181307 - Boo; Kelvin Tam Aik ; et al.	2022-06-09
Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer Grant 11,282,811 - Boo , et al. March 22, 2	2022-03-22
Surface Mount Device Bonded To An Inner Layer Of A Multi-layer Substrate App 20220078915 - Boo; Kelvin Tan Aik ; et al.	2022-03-10
Stacked Semiconductor Die Assemblies With Die Support Members And Associated Systems And Methods App 20210384167 - Ye; Seng Kim ; et al.	2021-12-09
Stacked Semiconductor Die Assemblies With Support Members And Associated Systems And Methods App 20210384185 - Ng; Hong Wan ; et al.	2021-12-09
Integrated Circuit Wire Bonded To A Multi-layer Substrate Having An Open Area That Exposes Wire Bond Pads At A Surface Of The Inner Layer App 20210358888 - Boo; Kelvin Tan Aik ; et al.	2021-11-18
Stacked semiconductor die assemblies with support members and associated systems and methods Grant 11,101,262 - Ng , et al. August 24, 2	2021-08-24
Stacked semiconductor die assemblies with die support members and associated systems and methods Grant 11,101,244 - Ye , et al. August 24, 2	2021-08-24
Memory Devices With Controllers Under Memory Packages And Associated Systems And Methods App 20200321318 - Ye; Seng Kim ; et al.	2020-10-08
Stacked Semiconductor Die Assemblies With Die Support Members And Associated Systems And Methods App 20200279832 - Ye; Seng Kim ; et al.	2020-09-03
Memory devices with controllers under memory packages and associated systems and methods Grant 10,727,206 - Ye , et al.	2020-07-28
Stacked semiconductor die assemblies with die support members and associated systems and methods Grant 10,658,336 - Ye , et al.	2020-05-19
Stacked Semiconductor Die Assemblies With Support Members And Associated Systems And Methods App 20200105737 - Ng; Hong Wan ; et al.	2020-04-02
Stacked semiconductor die assemblies with support members and associated systems and methods Grant 10,504,881 - Ng , et al. Dec	2019-12-10
Memory Devices With Controllers Under Memory Packages And Associated Systems And Methods App 20180350776 - Ye; Seng Kim ; et al.	2018-12-06
Memory devices with controllers under memory packages and associated systems and methods Grant 10,128,217 - Ye , et al. November 13, 2	2018-11-13
Stacked Semiconductor Die Assemblies With Die Support Members And Associated Systems And Methods App 20180240785 - Ye; Seng Kim ; et al.	2018-08-23
Stacked semiconductor die assemblies with die support members and associated systems and methods Grant 9,985,000 - Ye , et al. May 29, 2	2018-05-29
Memory Devices With Controllers Under Memory Packages And Associated Systems And Methods App 20170170149 - Ye; Seng Kim ; et al.	2017-06-15
Memory devices with controllers under memory packages and associated systems and methods Grant 9,627,367 - Ye , et al. April 18, 2	2017-04-18
Stacked Semiconductor Die Assemblies With Support Members And Associated Systems And Methods App 20160343699 - Ng; Hong Wan ; et al.	2016-11-24
Stacked Semiconductor Die Assemblies With Die Support Members And Associated Systems And Methods App 20160336300 - Ye; Seng Kim ; et al.	2016-11-17
Stacked semiconductor die assemblies with support members and associated systems and methods Grant 9,418,974 - Ng , et al. August 16, 2	2016-08-16
Stacked semiconductor die assemblies with die support members and associated systems and methods Grant 9,406,660 - Ye , et al. August 2, 2	2016-08-02
Memory Devices With Controllers Under Memory Packages And Associated Systems And Methods App 20160148918 - Ye; Seng Kim ; et al.	2016-05-26
Stacked Semiconductor Die Assemblies With Die Support Members And Associated Systems And Methods App 20150311186 - Ye; Seng Kim ; et al.	2015-10-29
Stacked Semiconductor Die Assemblies With Support Members And Associated Systems And Methods App 20150311185 - Ng; Hong Wan ; et al.	2015-10-29
Microelectronic packages with small footprints and associated methods of manufacturing Grant 8,923,004 - Low , et al. December 30, 2	2014-12-30
Microelectronic packages with small footprints and associated methods of manufacturing Grant 08923004 -	2014-12-30
Microelectronic Packages With Small Footprints And Associated Methods Of Manufacturing App 20100027233 - Low; Peng Wang ; et al.	2010-02-04

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