loadpatents
name:-0.020946979522705
name:-0.0059819221496582
name:-0.00085115432739258
Ye; Qianqiu Patent Filings

Ye; Qianqiu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ye; Qianqiu.The latest application filed is for "method for chemical mechanical polishing copper".

Company Profile
0.5.16
  • Ye; Qianqiu - Newark DE US
  • Ye; Qianqiu - Wilmington DE
  • Ye, Qianqiu - Willmington DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for chemical mechanical polishing copper
App 20130045599 - Ye; Qianqiu
2013-02-21
Polymeric barrier removal polishing slurry
Grant 7,785,487 - Thomas , et al. August 31, 2
2010-08-31
Selective barrier polishing slurry
App 20090032765 - Bian; Jinru ;   et al.
2009-02-05
Polymeric barrier removal polishing slurry
App 20090031636 - Ye; Qianqiu ;   et al.
2009-02-05
Alkaline barrier polishing slurry
App 20080276543 - Thomas; Terence M. ;   et al.
2008-11-13
Polishing compositions for noble metals
Grant 7,270,762 - Wang , et al. September 18, 2
2007-09-18
Polymeric barrier removal polishing slurry
App 20070051917 - Thomas; Terence M. ;   et al.
2007-03-08
Polishing composition
Grant 7,070,485 - Lack , et al. July 4, 2
2006-07-04
Polishing compositions for reducing erosion in semiconductor wafers
App 20060135045 - Bian; Jinru ;   et al.
2006-06-22
Polishing compositions for controlling metal interconnect removal rate in semiconductor wafers
App 20050194562 - Lavoie, Raymond Lee JR. ;   et al.
2005-09-08
Modular barrier removal polishing slurry
Grant 6,916,742 - Ye , et al. July 12, 2
2005-07-12
Compositions and methods for controlled polishing of copper
App 20050136670 - Ameen, Joseph G. ;   et al.
2005-06-23
Modular barrier removal polishing slurry
App 20040171265 - Ye, Qianqiu ;   et al.
2004-09-02
Polishing of semiconductor substrates
Grant 6,676,718 - Luo , et al. January 13, 2
2004-01-13
Polishing compositions for noble metals
App 20030176072 - Wang, Hongyu ;   et al.
2003-09-18
Polishing composition for CMP having abrasive particles
App 20030006396 - Wang, Hongyu ;   et al.
2003-01-09
Method and composition for polishing by CMP
App 20020146965 - Thomas, Terence M. ;   et al.
2002-10-10
Polishing of semiconductor substrates
App 20020132563 - Luo, Qiuliang ;   et al.
2002-09-19
Polishing compositions for noble metals
App 20020039839 - Thomas, Terence M. ;   et al.
2002-04-04
Polishing composition
App 20010044264 - Lack, Craig D. ;   et al.
2001-11-22

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