Patent | Date |
---|
Chip package structure and method for forming chip package Grant 11,232,999 - Ye January 25, 2 | 2022-01-25 |
Die Attachment Structure And Method For Manufacturing The Same App 20210384155 - Ye; Jiaming | 2021-12-09 |
Package Structure Applied To Power Converter App 20210343628 - Fang; Chiqing ;   et al. | 2021-11-04 |
Package Structure For Power Converter And Manufacture Method Thereof App 20210296213 - Ye; Jiaming | 2021-09-23 |
Package structure for power converter and manufacture method thereof Grant 11,056,421 - Ye July 6, 2 | 2021-07-06 |
Microfluidic devices for multi-index biochemical detection Grant 10,758,903 - Ye , et al. Sep | 2020-09-01 |
Integrated package assembly for switching regulator Grant 10,741,481 - Ye , et al. A | 2020-08-11 |
Chip Package Structure And Method For Forming Chip Package App 20200185311 - Ye; Jiaming | 2020-06-11 |
Chip package structure and method for forming chip package Grant 10,615,106 - Ye | 2020-04-07 |
Package structure of light emitter and light sensor with light-blocking layer and method for manufacturing the same Grant 10,333,019 - Shentu , et al. | 2019-06-25 |
Package Structure For Power Converter And Manufacture Method Thereof App 20180366395 - Ye; Jiaming | 2018-12-20 |
Package assembly having interconnect for stacked electronic devices and method for manufacturing the same Grant 10,128,221 - Tan , et al. November 13, 2 | 2018-11-13 |
Integrated Package Assembly For Switching Regulator App 20180277470 - Ye; Jiaming ;   et al. | 2018-09-27 |
Package structure for power converter and manufacture method thereof Grant 10,083,895 - Ye September 25, 2 | 2018-09-25 |
Integrated package assembly for switching regulator Grant 10,043,738 - Ye , et al. August 7, 2 | 2018-08-07 |
Package Structure And Method For Manufacturing The Same App 20170345961 - Shentu; Junli ;   et al. | 2017-11-30 |
Package assembly and method for manufacturing the same Grant 9,699,918 - Ye , et al. July 4, 2 | 2017-07-04 |
Biological chip hybridization system Grant 9,677,133 - Ye , et al. June 13, 2 | 2017-06-13 |
Automatic injection device for microarray chip and automatic injection hybridization microarray chip Grant 9,671,317 - Ye , et al. June 6, 2 | 2017-06-06 |
Chip package method and package assembly Grant 9,595,453 - Tan , et al. March 14, 2 | 2017-03-14 |
Multi-level leadframe with interconnect areas for soldering conductive bumps, multi-level package assembly and method for manufacturing the same Grant 9,559,043 - Ye January 31, 2 | 2017-01-31 |
Chip Package Method And Package Assembly App 20160365257 - Tan; Xiaochun ;   et al. | 2016-12-15 |
Chip Package Structure And Method For Forming Chip Package App 20160351483 - Ye; Jiaming | 2016-12-01 |
Chip package assembly and manufacturing method thereof Grant 9,508,677 - Ye , et al. November 29, 2 | 2016-11-29 |
Chip Package Assembly And Manufacturing Method Thereof App 20160284663 - Ye; Jiaming ;   et al. | 2016-09-29 |
Package Structure For Power Converter And Manufacture Method Thereof App 20160218087 - Ye; Jiaming | 2016-07-28 |
Package Assembly And Method For Manufacturing The Same App 20160113144 - Ye; Jiaming ;   et al. | 2016-04-21 |
Chip Package Structure App 20150249068 - Ye; Jiaming | 2015-09-03 |
Interface device for bio-chip Grant 9,101,924 - Ye , et al. August 11, 2 | 2015-08-11 |
Package Assembly And Method For Manufacturing The Same App 20150214200 - Tan; Xiaochun ;   et al. | 2015-07-30 |
Integrated Package Assembly For Switching Regulator App 20150214141 - Ye; Jiaming ;   et al. | 2015-07-30 |
Leadframe, Package Assembly And Method For Manufacturing The Same App 20150162271 - Ye; Jiaming | 2015-06-11 |
Microfluidic Devices For Multi-index Biochemical Detection App 20150132753 - Ye; Jiaming ;   et al. | 2015-05-14 |
Interface Device For Bio-chip App 20140010733 - Ye; Jiaming ;   et al. | 2014-01-09 |
Automatic Injection Device For Microarray Chip And Automatic Injection Hybridization Microarray Chip App 20140011703 - Ye; Jiaming ;   et al. | 2014-01-09 |
Biological Chip Hybridization System App 20140011707 - Ye; Jiaming ;   et al. | 2014-01-09 |