Yazu; Hajime
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yazu; Hajime.The latest application filed is for "conductive connecting pin and package substrate".
- Yazu; Hajime - Ogaki JP
- Yazu; Hajime - Ogaki-shi JP
| Patent | Date |
|---|---|
| Conductive pin attached to package substrate Grant 8,536,696 - Hirose , et al. September 17, 2 | 2013-09-17 |
| Package substrate with a conductive connecting pin Grant 8,110,917 - Hirose , et al. February 7, 2 | 2012-02-07 |
| Conductive connecting pin for package substance Grant 8,035,214 - Hirose , et al. October 11, 2 | 2011-10-11 |
| Conductive connecting pin and package substrate Grant 7,902,659 - Hirose , et al. March 8, 2 | 2011-03-08 |
| Conductive connecting pins for a package substrate Grant 7,847,393 - Hirose , et al. December 7, 2 | 2010-12-07 |
| Conductive Connecting Pin And Package Substrate App 20100032200 - HIROSE; Naohiro ; et al. | 2010-02-11 |
| Conductive Connecting Pin And Package Substrate App 20090314537 - HIROSE; Naohiro ; et al. | 2009-12-24 |
| Conductive Connecting Pin And Package Substrate App 20090154131 - HIROSE; Naohiro ; et al. | 2009-06-18 |
| Conductive Connecting Pin And Package Substrate App 20090053459 - Hirose; Naohiro ; et al. | 2009-02-26 |
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