Yauw; Oranna
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yauw; Oranna.The latest application filed is for "method of operating a clamping system of a wire bonding machine".
- Yauw; Oranna - Singapore SG
- Yauw; Oranna - Sunnyvale CA
| Patent | Date |
|---|---|
| Method Of Operating A Clamping System Of A Wire Bonding Machine App 20120104075 - Kang; Sung SIK ; et al. | 2012-05-03 |
| High selectivity and residue free process for metal on thin dielectric gate etch application Grant 6,933,243 - Shen , et al. August 23, 2 | 2005-08-23 |
| Self-cleaning process for etching silicon-containing material Grant 6,797,188 - Shen , et al. September 28, 2 | 2004-09-28 |
| High selectivity and residue free process for metal on thin dielectric gate etch application App 20030148622 - Shen, Meihua ; et al. | 2003-08-07 |
| Method of etching organic antireflection coating (ARC) layers Grant 6,599,437 - Yauw , et al. July 29, 2 | 2003-07-29 |
| Method of etching organic antireflection coating (ARC) layers App 20030029835 - Yauw, Oranna ; et al. | 2003-02-13 |
| Method Of Forming A Notched Silicon-containing Gate Structure App 20020151183 - Yang, Chan-syun David ; et al. | 2002-10-17 |
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