| Patent | Date |
|---|
Metal-insulator-metal Device With Improved Performance
App 20220310507 - Kao; Min-Feng ; et al. | 2022-09-29 |
Gate electrodes with notches and methods for forming the same
Grant 11,456,176 - Kao , et al. September 27, 2 | 2022-09-27 |
Through Silicon Via Design For Stacking Integrated Circuits
App 20220302108 - Thei; Kong-Beng ; et al. | 2022-09-22 |
Mechanisms For Forming Image-sensor Device With Deep-trench Isolation Structure
App 20220293644 - LIN; Jeng-Shyan ; et al. | 2022-09-15 |
Image sensor with overlap of backside trench isolation structure and vertical transfer gate
Grant 11,437,420 - Hung , et al. September 6, 2 | 2022-09-06 |
Bonded Semiconductor Device And Method For Forming The Same
App 20220277127 - Huang; Shih-Han ; et al. | 2022-09-01 |
Through Silicon Vias And Methods Of Fabricating Thereof
App 20220277998 - KAO; Min-Feng ; et al. | 2022-09-01 |
Image Sensor
App 20220278144 - Kao; Min-Feng ; et al. | 2022-09-01 |
Stacked Semiconductor Device And Method
App 20220278095 - Kao; Min-Feng ; et al. | 2022-09-01 |
Method for manufacturing semiconductor image sensor device having deep trench isolation
Grant 11,430,823 - Chiang , et al. August 30, 2 | 2022-08-30 |
Semiconductor structure and method for manufacturing the same
Grant 11,424,228 - Kao , et al. August 23, 2 | 2022-08-23 |
Hybrid Bonding Technology For Stacking Integrated Circuits
App 20220262770 - Wu; Kuo-Ming ; et al. | 2022-08-18 |
Pad Structure For Front Side Illuminated Image Sensor
App 20220254828 - Hsu; Kai-Chun ; et al. | 2022-08-11 |
Hybrid bonding technology for stacking integrated circuits
Grant 11,410,972 - Wu , et al. August 9, 2 | 2022-08-09 |
Backside capacitor techniques
Grant 11,404,534 - Kao , et al. August 2, 2 | 2022-08-02 |
Stacked Structure For Cmos Image Sensors
App 20220238568 - Kao; Min-Feng ; et al. | 2022-07-28 |
High Capacitance Mim Device With Self Aligned Spacer
App 20220238636 - Chu; Ching-Sheng ; et al. | 2022-07-28 |
Image Sensor And Manufacturing Method Thereof
App 20220231058 - Kao; Min-Feng ; et al. | 2022-07-21 |
Backside Or Frontside Through Substrate Via (tsv) Landing On Metal
App 20220223498 - Li; Zheng-Xun ; et al. | 2022-07-14 |
Semiconductor Device Including Image Sensor And Method Of Forming The Same
App 20220223635 - Kao; Min-Feng ; et al. | 2022-07-14 |
Semiconductor structure and manufacturing method for the same
Grant 11,387,167 - Kao , et al. July 12, 2 | 2022-07-12 |
High Density Image Sensor
App 20220216262 - Takahashi; Seiji ; et al. | 2022-07-07 |
Backside Contact To Improve Thermal Dissipation Away From Semiconductor Devices
App 20220216185 - Kao; Min-Feng ; et al. | 2022-07-07 |
Semiconductor Devices And Methods Of Manufacture Thereof
App 20220208749 - Tsai; Shu-Ting ; et al. | 2022-06-30 |
Oversized Via As Through-substrate-via (tsv) Stop Layer
App 20220208651 - Kao; Min-Feng ; et al. | 2022-06-30 |
Hybrid Bonding with Uniform Pattern Density
App 20220173092 - Chen; Szu-Ying ; et al. | 2022-06-02 |
Manufacturing method of image sensing device
Grant 11,342,373 - Wu , et al. May 24, 2 | 2022-05-24 |
Mechanisms for forming image-sensor device with deep-trench isolation structure
Grant 11,342,374 - Lin , et al. May 24, 2 | 2022-05-24 |
Bond Pad Structure For Bonding Improvement
App 20220157864 - Huang; Sin-Yao ; et al. | 2022-05-19 |
Pad structure for front side illuminated image sensor
Grant 11,322,540 - Hsu , et al. May 3, 2 | 2022-05-03 |
Hybrid bonding technology for stacking integrated circuits
Grant 11,322,481 - Wu , et al. May 3, 2 | 2022-05-03 |
High density image sensor
Grant 11,309,348 - Takahashi , et al. April 19, 2 | 2022-04-19 |
Backside contact to improve thermal dissipation away from semiconductor devices
Grant 11,289,455 - Kao , et al. March 29, 2 | 2022-03-29 |
Oversized via as through-substrate-via (TSV) stop layer
Grant 11,282,769 - Kao , et al. March 22, 2 | 2022-03-22 |
Semiconductor device structure and method for forming the same
Grant 11,282,802 - Yang , et al. March 22, 2 | 2022-03-22 |
Extra Doped Region For Back-side Deep Trench Isolation
App 20220059583 - Chen; Chun-Yuan ; et al. | 2022-02-24 |
Hybrid bonding with uniform pattern density
Grant 11,257,805 - Yaung , et al. February 22, 2 | 2022-02-22 |
Semiconductor device structure with back-side layer to reduce leakage
Grant 11,244,925 - Kao , et al. February 8, 2 | 2022-02-08 |
Bond pad structure for bonding improvement
Grant 11,244,981 - Huang , et al. February 8, 2 | 2022-02-08 |
Extra doped region for back-side deep trench isolation
Grant 11,227,889 - Chen , et al. January 18, 2 | 2022-01-18 |
Integrated circuit (IC) structure for high performance and functional density
Grant 11,222,814 - Kao , et al. January 11, 2 | 2022-01-11 |
Pad structure for front side illuminated image sensor
Grant 11,222,915 - Hsu , et al. January 11, 2 | 2022-01-11 |
Integrated circuit (IC) structure for high performance and functional density
Grant 11,217,478 - Kao , et al. January 4, 2 | 2022-01-04 |
Composite bsi structure and method of manufacturing the same
Grant 11,211,419 - Wu , et al. December 28, 2 | 2021-12-28 |
Backside Contact To Improve Thermal Dissipation Away From Semiconductor Devices
App 20210391302 - Kao; Min-Feng ; et al. | 2021-12-16 |
Oversized Via As Through-substrate-via (tsv) Stop Layer
App 20210391237 - Kao; Min-Feng ; et al. | 2021-12-16 |
Composite Bsi Structure And Method Of Manufacturing The Same
App 20210366956 - Wu; Wei Chuang ; et al. | 2021-11-25 |
Stacked semiconductor dies with a conductive feature passing through a passivation layer
Grant 11,177,307 - Kao , et al. November 16, 2 | 2021-11-16 |
Structure For Standard Logic Performance Improvement Having A Back-side Through-substrate-via
App 20210351134 - Kao; Min-Feng ; et al. | 2021-11-11 |
Through Silicon Via Design For Stacking Integrated Circuits
App 20210343707 - Thei; Kong-Beng ; et al. | 2021-11-04 |
Apparatus for Reducing Optical Cross-Talk in Image Sensors
App 20210335871 - Lin; Chin-Min ; et al. | 2021-10-28 |
Image sensor including dual isolation and method of making the same
Grant 11,152,414 - Lin , et al. October 19, 2 | 2021-10-19 |
Device Over Photodetector Pixel Sensor
App 20210320139 - Sze; Jhy-Jyi ; et al. | 2021-10-14 |
Shield Structure For Backside Through Substrate Vias (tsvs)
App 20210320052 - Kao; Min-Feng ; et al. | 2021-10-14 |
Stacked Substrate Structure With Inter-tier Interconnection
App 20210313376 - Lin; Jeng-Shyan ; et al. | 2021-10-07 |
Metal Reflector Grounding For Noise Reduction In Light Detector
App 20210313383 - Chiang; Yen-Ting ; et al. | 2021-10-07 |
High density MIM capacitor structure
Grant 11,139,367 - Takahashi , et al. October 5, 2 | 2021-10-05 |
Semiconductor Packaging Device Comprising A Shield Structure
App 20210296258 - Chien; Wei-Yu ; et al. | 2021-09-23 |
Hybrid Bond Pad Structure
App 20210288029 - Huang; Sin-Yao ; et al. | 2021-09-16 |
Pixel structure of image sensor having dielectric layer surrounding photo conversion layer and color filter
Grant 11,121,159 - Wang , et al. September 14, 2 | 2021-09-14 |
Semiconductor Imaging Device Having Improved Dark Current Performance
App 20210280620 - Takahashi; Seiji ; et al. | 2021-09-09 |
Implant isolated devices and method for forming the same
Grant 11,114,486 - Kao , et al. September 7, 2 | 2021-09-07 |
Structure for standard logic performance improvement having a back-side through-substrate-via
Grant 11,107,767 - Kao , et al. August 31, 2 | 2021-08-31 |
Metal block and bond pad structure
Grant 11,088,192 - Ho , et al. August 10, 2 | 2021-08-10 |
Metal reflector grounding for noise reduction in light detector
Grant 11,088,196 - Chiang , et al. August 10, 2 | 2021-08-10 |
Interconnect Structure for Stacked Device
App 20210233813 - Tsai; Shu-Ting ; et al. | 2021-07-29 |
Stacked Semiconductor Structure and Method
App 20210225813 - Chen; Szu-Ying ; et al. | 2021-07-22 |
Apparatus for reducing optical cross-talk in image sensors
Grant 11,069,731 - Lin , et al. July 20, 2 | 2021-07-20 |
Via support structure under pad areas for BSI bondability improvement
Grant 11,069,736 - Huang , et al. July 20, 2 | 2021-07-20 |
Through silicon via design for stacking integrated circuits
Grant 11,063,038 - Thei , et al. July 13, 2 | 2021-07-13 |
Implant damage free image sensor and method of the same
Grant 11,063,080 - Kalnitsky , et al. July 13, 2 | 2021-07-13 |
Device over photodetector pixel sensor
Grant 11,063,081 - Sze , et al. July 13, 2 | 2021-07-13 |
Shield structure for backside through substrate vias (TSVs)
Grant 11,062,977 - Kao , et al. July 13, 2 | 2021-07-13 |
Image Sensor With Overlap Of Backside Trench Isolation Structure And Vertical Transfer Gate
App 20210210532 - Hung; Feng-Chi ; et al. | 2021-07-08 |
Stacked substrate structure with inter-tier interconnection
Grant 11,043,522 - Lin , et al. June 22, 2 | 2021-06-22 |
Stacked semiconductor structure and method
Grant 11,037,909 - Chen , et al. June 15, 2 | 2021-06-15 |
Semiconductor packaging device comprising a shield structure
Grant 11,037,885 - Chien , et al. June 15, 2 | 2021-06-15 |
Hybrid bond pad structure
Grant 11,024,602 - Huang , et al. June 1, 2 | 2021-06-01 |
Methods and Apparatus for Via Last Through-Vias
App 20210159264 - Chen; Szu-Ying ; et al. | 2021-05-27 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210159176 - CHEN; HSIN-HUNG ; et al. | 2021-05-27 |
Metal Reflector Grounding For Noise Reduction In Light Detector
App 20210151495 - Chiang; Yen-Ting ; et al. | 2021-05-20 |
Structure and method for 3D image sensor
Grant 11,011,567 - Kao , et al. May 18, 2 | 2021-05-18 |
Back Side Illuminated Image Sensor with Reduced Sidewall-Induced Leakage
App 20210143208 - Tsai; Shuang-Ji ; et al. | 2021-05-13 |
Semiconductor imaging device having improved dark current performance
Grant 11,004,880 - Takahashi , et al. May 11, 2 | 2021-05-11 |
Vertically integrated image sensor chips and methods for forming the same
Grant 10,991,752 - Lin , et al. April 27, 2 | 2021-04-27 |
Method For Forming Semiconductor Image Sensor
App 20210118933 - SZE; JHY-JYI ; et al. | 2021-04-22 |
Interconnect structure for stacked device
Grant 10,978,345 - Tsai , et al. April 13, 2 | 2021-04-13 |
Through silicon via design for stacking integrated circuits
Grant 10,964,692 - Thei , et al. March 30, 2 | 2021-03-30 |
Ion Through-substrate Via
App 20210082787 - Shen; Yu-Yang ; et al. | 2021-03-18 |
High Density Image Sensor
App 20210074758 - Takahashi; Seiji ; et al. | 2021-03-11 |
Method and apparatus for image sensor packaging
Grant 10,930,699 - Chen , et al. February 23, 2 | 2021-02-23 |
Semiconductor Packaging Device Comprising A Shield Structure
App 20210050303 - Chien; Wei-Yu ; et al. | 2021-02-18 |
Method For Manufacturing Semiconductor Image Sensor Device
App 20210043664 - CHIANG; YEN-TING ; et al. | 2021-02-11 |
Semiconductor device and manufacturing method thereof
Grant 10,916,502 - Chen , et al. February 9, 2 | 2021-02-09 |
Semiconductor switching device separate by device isolation
Grant 10,910,420 - Kao , et al. February 2, 2 | 2021-02-02 |
Pad Structure For Front Side Illuminated Image Sensor
App 20210028219 - Hsu; Kai-Chun ; et al. | 2021-01-28 |
Semiconductor Structure And Method For Manufacturing The Same
App 20210020617 - KAO; MIN-FENG ; et al. | 2021-01-21 |
Semiconductor Imaging Device Having Improved Dark Current Performance
App 20210005649 - Takahashi; Seiji ; et al. | 2021-01-07 |
Mechanisms for forming image-sensor device with epitaxial isolation feature
Grant 10,886,320 - Hsu , et al. January 5, 2 | 2021-01-05 |
Backside Capacitor Techniques
App 20200411636 - Kao; Min-Feng ; et al. | 2020-12-31 |
Image sensor device and method of forming same
Grant 10,879,297 - Wang , et al. December 29, 2 | 2020-12-29 |
Semiconductor Device Structure
App 20200402954 - Kao; Min-Feng ; et al. | 2020-12-24 |
Semiconductor Device Structure With A Conductive Feature Passing Through A Passivation Layer
App 20200395398 - Kao; Min-Feng ; et al. | 2020-12-17 |
Method for forming semiconductor image sensor
Grant 10,868,071 - Sze , et al. December 15, 2 | 2020-12-15 |
Ion through-substrate via
Grant 10,867,891 - Shen , et al. December 15, 2 | 2020-12-15 |
Multiple deep trench isolation (MDTI) structure for CMOS image sensor
Grant 10,861,894 - Wu , et al. December 8, 2 | 2020-12-08 |
Interconnect structure for stacked device and method
Grant 10,861,899 - Chuang , et al. December 8, 2 | 2020-12-08 |
Shield Structure For Backside Through Substrate Vias (tsvs)
App 20200381512 - Kao; Min-Feng ; et al. | 2020-12-03 |
Semiconductor Switching Device Separate by Device Isolation
App 20200365634 - Kao; Min-Feng ; et al. | 2020-11-19 |
Pad structure for front side illuminated image sensor
Grant 10,833,119 - Hsu , et al. November 10, 2 | 2020-11-10 |
Semiconductor image sensor device with deep trench isolations and method for manufacturing the same
Grant 10,825,853 - Chiang , et al. November 3, 2 | 2020-11-03 |
Multiple Deep Trench Isolation (mdti) Structure For Cmos Image Sensor
App 20200343281 - Wu; Wei Chuang ; et al. | 2020-10-29 |
Semiconductor Structure And Manufacturing Method For The Same
App 20200335427 - KAO; MIN-FENG ; et al. | 2020-10-22 |
Semiconductor structure and method for manufacturing the same
Grant 10,811,398 - Kao , et al. October 20, 2 | 2020-10-20 |
Inductor structure for integrated circuit
Grant 10,804,155 - Huang , et al. October 13, 2 | 2020-10-13 |
Image Sensor Device
App 20200321373 - Chen; Szu-Ying ; et al. | 2020-10-08 |
Semiconductor imaging device having improved dark current performance
Grant 10,797,091 - Takahashi , et al. October 6, 2 | 2020-10-06 |
Hybrid Bonding Technology For Stacking Integrated Circuits
App 20200312817 - Wu; Kuo-Ming ; et al. | 2020-10-01 |
Interconnect Structure and Method of Forming Same
App 20200306552 - Tsai; Shu-Ting ; et al. | 2020-10-01 |
Semiconductor device structure with back-side layer to reduce leakage
Grant 10,790,265 - Kao , et al. September 29, 2 | 2020-09-29 |
Inductor structure for integrated circuit
Grant 10,790,194 - Huang , et al. September 29, 2 | 2020-09-29 |
Semiconductor device structure with a conductive feature passing through a passivation layer
Grant 10,790,327 - Kao , et al. September 29, 2 | 2020-09-29 |
Hybrid Bonding Technology For Stacking Integrated Circuits
App 20200303351 - Wu; Kuo-Ming ; et al. | 2020-09-24 |
Implant Damage Free Image Sensor And Method Of The Same
App 20200303431 - KALNITSKY; ALEXANDER ; et al. | 2020-09-24 |
Mechanisms For Forming Image-sensor Device With Deep-trench Isolation Structure
App 20200303429 - LIN; Jeng-Shyan ; et al. | 2020-09-24 |
Method for forming image sensor device structure with doping layer in light-sensing region
Grant 10,777,590 - Chiang , et al. Sept | 2020-09-15 |
Interconnect apparatus and method for a stacked semiconductor device
Grant 10,763,292 - Lin , et al. Sep | 2020-09-01 |
Stacked Integrated Circuits with Redistribution Lines
App 20200258865 - A1 | 2020-08-13 |
Semiconductor Device Structure With A Conductive Feature Passing Through A Passivation Layer
App 20200258931 - A1 | 2020-08-13 |
Image sensor device
Grant 10,734,428 - Chen , et al. | 2020-08-04 |
Semiconductor switching device separated by device isolation
Grant 10,734,423 - Kao , et al. | 2020-08-04 |
Manufacturing Method Of Image Sensing Device
App 20200243580 - Wu; Wei-Chuang ; et al. | 2020-07-30 |
Through Silicon Via Design For Stacking Integrated Circuits
App 20200243516 - Thei; Kong-Beng ; et al. | 2020-07-30 |
Semiconductor structure and manufacturing method for the same
Grant 10,727,164 - Kao , et al. | 2020-07-28 |
Multiple deep trench isolation (MDTI) structure for CMOS image sensor
Grant 10,727,265 - Wu , et al. | 2020-07-28 |
Hybrid bonding technology for stacking integrated circuits
Grant 10,727,205 - Wu , et al. | 2020-07-28 |
Implant damage free image sensor and method of the same
Grant 10,692,914 - Kalnitsky , et al. | 2020-06-23 |
Interconnect structure and method of forming same
Grant 10,682,523 - Tsai , et al. | 2020-06-16 |
Stacked semiconductor dies with a conductive feature passing through a passivation layer
Grant 10,680,027 - Kao , et al. | 2020-06-09 |
Device Over Photodetector Pixel Sensor
App 20200176500 - Sze; Jhy-Jyi ; et al. | 2020-06-04 |
Mechanisms for forming image-sensor device with deep-trench isolation structure
Grant 10,672,819 - Lin , et al. | 2020-06-02 |
Structure For Standard Logic Performance Improvement Having A Back-side Through-substrate-via
App 20200161244 - Kao; Min-Feng ; et al. | 2020-05-21 |
Bond Pad Structure For Bonding Improvement
App 20200152675 - Huang; Sin-Yao ; et al. | 2020-05-14 |
Semiconductor Device Structure And Method For Manufacturing The Same
App 20200144244 - HO; CHENG-YING ; et al. | 2020-05-07 |
Back Side Illuminated Image Sensor with Reduced Sidewall-Induced Leakage
App 20200144325 - Tsai; Shuang-Ji ; et al. | 2020-05-07 |
Ion Through-substrate Via
App 20200135617 - Shen; Yu-Yang ; et al. | 2020-04-30 |
Via Support Structure Under Pad Areas For Bsi Bondability Improvement
App 20200135794 - Huang; Sin-Yao ; et al. | 2020-04-30 |
High Density Mim Capacitor Structure
App 20200135844 - Takahashi; Seiji ; et al. | 2020-04-30 |
Apparatus for Reducing Optical Cross-Talk in Image Sensors
App 20200127042 - Lin; Chin-Min ; et al. | 2020-04-23 |
Interconnect Structure for Stacked Device and Method
App 20200127027 - Chuang; Chun-Chieh ; et al. | 2020-04-23 |
Through silicon via design for stacking integrated circuits
Grant 10,629,592 - Thei , et al. | 2020-04-21 |
Stacked integrated circuits with redistribution lines
Grant 10,629,568 - Ho , et al. | 2020-04-21 |
3DIC Seal Ring Structure and Methods of Forming Same
App 20200119074 - Ho; Cheng-Ying ; et al. | 2020-04-16 |
Image sensing device
Grant 10,622,394 - Wu , et al. | 2020-04-14 |
Gate Electrodes with Notches and Methods for Forming the Same
App 20200083049 - Kao; Min-Feng ; et al. | 2020-03-12 |
Stacked Semiconductor Structure and Method
App 20200075556 - Chen; Szu-Ying ; et al. | 2020-03-05 |
Structure and Method for 3D Image Sensor
App 20200075659 - Kao; Min-Feng ; et al. | 2020-03-05 |
Semiconductor Switching Device Separated by Device Isolation
App 20200066774 - Kao; Min-Feng ; et al. | 2020-02-27 |
Extra Doped Region For Back-side Deep Trench Isolation
App 20200066770 - Chen; Chun-Yuan ; et al. | 2020-02-27 |
Integrated Circuit (ic) Structure For High Performance And Functional Density
App 20200066584 - Kao; Min-Feng ; et al. | 2020-02-27 |
Hybrid bonding technology for stacking integrated circuits
App 20200058617 - Wu; Kuo-Ming ; et al. | 2020-02-20 |
Multiple Deep Trench Isolation (mdti) Structure For Cmos Image Sensor
App 20200058685 - Wu; Wei Chuang ; et al. | 2020-02-20 |
Composite Bsi Structure And Method Of Manufacturing The Same
App 20200058684 - Wu; Wei Chuang ; et al. | 2020-02-20 |
Multiple Deep Trench Isolation (mdti) Structure For Cmos Image Sensor
App 20200058686 - Wu; Wei Chuang ; et al. | 2020-02-20 |
Structure for standard logic performance improvement having a back-side through-substrate-via
Grant 10,566,288 - Kao , et al. Feb | 2020-02-18 |
Via support structure under pad areas for BSI bondability improvement
Grant 10,566,374 - Huang , et al. Feb | 2020-02-18 |
Back side illuminated image sensor with reduced sidewall-induced leakage
Grant 10,566,378 - Tsai , et al. Feb | 2020-02-18 |
Method For Forming Semiconductor Image Sensor
App 20200043967 - SZE; JHY-JYI ; et al. | 2020-02-06 |
Integrated Circuit (ic) Structure For High Performance And Functional Density
App 20200043783 - Kao; Min-Feng ; et al. | 2020-02-06 |
Method For Forming Image Sensor Device Structure With Doping Layer In Light-sensing Region
App 20200035723 - CHIANG; Yen-Ting ; et al. | 2020-01-30 |
Method and Apparatus for Image Sensor Packaging
App 20200035743 - Chen; Szu-Ying ; et al. | 2020-01-30 |
Through Silicon Via Design For Stacking Integrated Circuits
App 20200035672 - Thei; Kong-Beng ; et al. | 2020-01-30 |
Inductor Structure For Integrated Circuit
App 20200027790 - Huang; Shih-Han ; et al. | 2020-01-23 |
Inductor Structure For Integrated Circuit
App 20200027789 - Huang; Shih-Han ; et al. | 2020-01-23 |
Pixel Structure of Image Sensor and Method of Forming Same
App 20200020729 - Wang; Tzu-Jui ; et al. | 2020-01-16 |
Interconnect structure for stacked device and method
Grant 10,535,706 - Chuang , et al. Ja | 2020-01-14 |
Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips
Grant 10,535,696 - Lin , et al. Ja | 2020-01-14 |
Structure and method for 3D Image sensor
Grant 10,535,697 - Kao , et al. Ja | 2020-01-14 |
Semiconductor Device Structure And Method For Forming The Same
App 20200013736 - Yang; Ming-Hsien ; et al. | 2020-01-09 |
Apparatus for reducing optical cross-talk in image sensors
Grant 10,522,586 - Lin , et al. Dec | 2019-12-31 |
Semiconductor device structure
Grant 10,522,525 - Ho , et al. Dec | 2019-12-31 |
Bond pad structure for bonding improvement
Grant 10,515,995 - Huang , et al. Dec | 2019-12-24 |
Semiconductor devices, methods of manufacturing thereof, and image sensor devices
Grant 10,515,994 - Chuang , et al. Dec | 2019-12-24 |
Elevated photodiode with a stacked scheme
Grant 10,510,791 - Wan , et al. Dec | 2019-12-17 |
High-k dielectric liners in shallow trench isolations
Grant 10,510,790 - Chen , et al. Dec | 2019-12-17 |
Stacked semiconductor structure and method
Grant 10,510,730 - Chen , et al. Dec | 2019-12-17 |
3DIC seal ring structure and methods of forming same
Grant 10,510,792 - Ho , et al. Dec | 2019-12-17 |
Gate electrodes with notches and methods for forming the same
Grant 10,510,542 - Kao , et al. Dec | 2019-12-17 |
Image sensor device and method
Grant 10,510,912 - Huang , et al. Dec | 2019-12-17 |
Extra doped region for back-side deep trench isolation
Grant 10,510,789 - Chen , et al. Dec | 2019-12-17 |
3DIC interconnect apparatus and method
Grant 10,510,729 - Tsai , et al. Dec | 2019-12-17 |
Integrated circuit (IC) structure for high performance and functional density
Grant 10,510,592 - Kao , et al. Dec | 2019-12-17 |
Uniform-size bonding patterns
Grant 10,510,793 - Chen , et al. Dec | 2019-12-17 |
Inductor structure for integrated circuit
Grant 10,504,784 - Huang , et al. Dec | 2019-12-10 |
Hybrid Bonding with Uniform Pattern Density
App 20190371780 - Yaung; Dun-Nian ; et al. | 2019-12-05 |
Semiconductor Imaging Device Having Improved Dark Current Performance
App 20190371838 - Takahashi; Seiji ; et al. | 2019-12-05 |
Through Silicon Via Design For Stacking Integrated Circuits
App 20190363079 - Thei; Kong-Beng ; et al. | 2019-11-28 |
Image sensor pickup region layout
Grant 10,490,580 - Yaung , et al. Nov | 2019-11-26 |
High-k Dielectric Liners in Shallow Trench Isolations
App 20190348451 - Chen; Szu-Ying ; et al. | 2019-11-14 |
Image sensor device structure with doping layer in light-sensing region
Grant 10,475,828 - Chiang , et al. Nov | 2019-11-12 |
Method and apparatus for image sensor packaging
Grant 10,475,843 - Chen , et al. Nov | 2019-11-12 |
Semiconductor device structure and method for forming the same
Grant 10,475,758 - Yang , et al. Nov | 2019-11-12 |
Semiconductor image sensor and method for forming the same
Grant 10,468,448 - Jhy-Jyi , et al. No | 2019-11-05 |
Pixel structure of image sensor and method of forming same
Grant 10,468,443 - Wang , et al. No | 2019-11-05 |
Semiconductor switching device separated by device isolation
Grant 10,468,441 - Kao , et al. No | 2019-11-05 |
Multiple deep trench isolation (MDTI) structure for CMOS image sensor
Grant 10,461,109 - Wu , et al. Oc | 2019-10-29 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20190279974 - Tsai; Shu-Ting ; et al. | 2019-09-12 |
Hybrid bonding with uniform pattern density
Grant 10,388,642 - Yaung , et al. A | 2019-08-20 |
Uniform-Size Bonding Patterns
App 20190252446 - Chen; Szu-Ying ; et al. | 2019-08-15 |
Semiconductor Device Structure With A Conductive Feature Passing Through A Passivation Layer
App 20190252445 - Kao; Min-Feng ; et al. | 2019-08-15 |
Stacked Integrated Circuits with Redistribution Lines
App 20190252354 - Ho; Cheng-Ying ; et al. | 2019-08-15 |
Mechanisms For Forming Image-sensor Device With Epitaxial Isolation Feature
App 20190244990 - Hsu; Wen-I ; et al. | 2019-08-08 |
Image Sensor Device and Method of Forming Same
App 20190244999 - Wang; Wen-De ; et al. | 2019-08-08 |
Methods and Apparatus for Via Last Through-Vias
App 20190237505 - Chen; Szu-Ying ; et al. | 2019-08-01 |
High-k dielectric liners in shallow trench isolations
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Hybrid Bond Pad Structure
App 20190221548 - Huang; Sin-Yao ; et al. | 2019-07-18 |
Extra Doped Region For Back-side Deep Trench Isolation
App 20190214414 - Chen; Chun-Yuan ; et al. | 2019-07-11 |
Image Sensor Including Dual Isolation And Method Of Making The Same
App 20190172857 - LIN; Jeng-Shyan ; et al. | 2019-06-06 |
Semiconductor Image Sensor And Method For Forming The Same
App 20190165025 - JHY-JYI; SZE ; et al. | 2019-05-30 |
Multiple Deep Trench Isolation (mdti) Structure For Cmos Image Sensor
App 20190165009 - Wu; Wei Chuang ; et al. | 2019-05-30 |
Method of manufacturing semiconductor devices having conductive plugs with varying widths
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Back-side deep trench isolation (BDTI) structure for pinned photodiode image sensor
Grant 10,304,886 - Chiang , et al. | 2019-05-28 |
Image Sensor Device Structure With Doping Layer In Light-sensing Region
App 20190157319 - CHIANG; Yen-Ting ; et al. | 2019-05-23 |
Metal block and bond pad structure
Grant 10,297,631 - Ho , et al. | 2019-05-21 |
Method for an image sensor device
Grant 10,297,632 - Chen , et al. | 2019-05-21 |
Interconnect Apparatus and Method
App 20190148435 - Lin; Jeng-Shyan ; et al. | 2019-05-16 |
Semiconductor Structure And Manufacturing Method For The Same
App 20190148266 - KAO; MIN-FENG ; et al. | 2019-05-16 |
Image sensor device and method of forming same
Grant 10,290,671 - Wang , et al. | 2019-05-14 |
Image Sensor Device and Method
App 20190140112 - Huang; Kuo-Chin ; et al. | 2019-05-09 |
Semiconductor Image Sensor Device And Method For Manufacturing The Same
App 20190139997 - CHIANG; YEN-TING ; et al. | 2019-05-09 |
Implant Damage Free Image Sensor And Method Of The Same
App 20190139999 - KALNITSKY; ALEXANDER ; et al. | 2019-05-09 |
Via support structure under pad areas for BSI bondability improvement
Grant 10,283,549 - Huang , et al. | 2019-05-07 |
Interconnect Structure for Stacked Device and Method
App 20190131330 - Chuang; Chun-Chieh ; et al. | 2019-05-02 |
Extra doped region for back-side deep trench isolation
Grant 10,276,618 - Chen , et al. | 2019-04-30 |
Mechanisms for forming image-sensor device with expitaxial isolation feature
Grant 10,276,622 - Hsu , et al. | 2019-04-30 |
Semiconductor device structure with a conductive feature passing through a passivation layer
Grant 10,276,619 - Kao , et al. | 2019-04-30 |
Stacked Semiconductor Structure and Method
App 20190123026 - Chen; Szu-Ying ; et al. | 2019-04-25 |
Inductor Structure For Integrated Circuit
App 20190122931 - Huang; Shih-Han ; et al. | 2019-04-25 |
Pixel Structure Of Image Sensor And Method Of Forming Same
App 20190123085 - Wang; Tzu-Jui ; et al. | 2019-04-25 |
Vertically Integrated Image Sensor Chips and Methods for Forming the Same
App 20190123092 - Lin; Jeng-Shyan ; et al. | 2019-04-25 |
Stacked integrated circuits with redistribution lines
Grant 10,269,768 - Ho , et al. | 2019-04-23 |
Image sensor having enhanced backside illumination quantum efficiency
Grant 10,269,848 - Liao , et al. | 2019-04-23 |
Hybrid bond pad structure
Grant 10,269,770 - Huang , et al. | 2019-04-23 |
Methods and apparatus for via last through-vias
Grant 10,269,863 - Chen , et al. | 2019-04-23 |
Image Sensor Device
App 20190115376 - Chen; Szu-Ying ; et al. | 2019-04-18 |
3DIC Interconnect Apparatus and Method
App 20190115322 - Tsai; Shu-Ting ; et al. | 2019-04-18 |
Semiconductor Structure And Method For Manufacturing The Same
App 20190109123 - KAO; MIN-FENG ; et al. | 2019-04-11 |
Mechanisms For Forming Image-sensor Device With Deep-trench Isolation Structure
App 20190103424 - LIN; Jeng-Shyan ; et al. | 2019-04-04 |
Back-side Deep Trench Isolation (bdti) Structure For Pinned Photodiode Image Sensor
App 20190096929 - Chiang; Yen-Ting ; et al. | 2019-03-28 |
Semiconductor Switching Device Separated by Device Isolation
App 20190096937 - Kao; Min-Feng ; et al. | 2019-03-28 |
Structure For Stacked Logic Performance Improvement
App 20190067200 - Kao; Min-Feng ; et al. | 2019-02-28 |
Stacked Substrate Structure With Inter-tier Interconnection
App 20190067358 - Lin; Jeng-Shyan ; et al. | 2019-02-28 |
Via Support Structure Under Pad Areas For Bsi Bondability Improvement
App 20190057998 - Huang; Sin-Yao ; et al. | 2019-02-21 |
Interconnect Structure For Stacked Device
App 20190051559 - Tsai; Shu-Ting ; et al. | 2019-02-14 |
Interconnect Structure and Method of Forming Same
App 20190046806 - Tsai; Shu-Ting ; et al. | 2019-02-14 |
Semiconductor Devices, Methods of Manufacturing Thereof, and Image Sensor Devices
App 20190043912 - Chuang; Chun-Chieh ; et al. | 2019-02-07 |
Image sensor including dual isolation and method of making the same
Grant 10,192,918 - Lin , et al. Ja | 2019-01-29 |
Semiconductor Device And Manufacturing Method Thereof
App 20190013270 - CHEN; HSIN-HUNG ; et al. | 2019-01-10 |
Elevated Photodiode with a Stacked Scheme
App 20190013345 - Wan; Meng-Hsun ; et al. | 2019-01-10 |
Implant damage free image sensor and method of the same
Grant 10,177,187 - Kalnitsky , et al. J | 2019-01-08 |
Pixel structure of image sensor and method of forming same
Grant 10,177,186 - Wang , et al. J | 2019-01-08 |
Uniform-size bonding patterns
Grant 10,170,512 - Chen , et al. J | 2019-01-01 |
Semiconductor structure and manufacturing method for the same
Grant 10,163,758 - Kao , et al. Dec | 2018-12-25 |
Semiconductor structure and method for manufacturing the same
Grant 10,163,878 - Kao , et al. Dec | 2018-12-25 |
Image sensor device and method
Grant 10,164,133 - Huang , et al. Dec | 2018-12-25 |
Image sensor device
Grant 10,163,951 - Chen , et al. Dec | 2018-12-25 |
Interconnect apparatus and method
Grant 10,163,956 - Lin , et al. Dec | 2018-12-25 |
3DIC Interconnect Apparatus and Method
App 20180366447 - Tsai; Shu-Ting ; et al. | 2018-12-20 |
Vertically integrated image sensor chips and methods for forming the same
Grant 10,157,958 - Lin , et al. Dec | 2018-12-18 |
Interconnect structure for stacked device and method
Grant 10,157,959 - Chuang , et al. Dec | 2018-12-18 |
3DIC interconnect apparatus and method
Grant 10,157,891 - Tsai , et al. Dec | 2018-12-18 |
Stacked semiconductor structure and method
Grant 10,157,889 - Chen , et al. Dec | 2018-12-18 |
Mechanisms for forming image sensor device with deep-trench isolation structure
Grant 10,153,316 - Lin , et al. Dec | 2018-12-11 |
Bond Pad Structure For Bonding Improvement
App 20180350857 - Huang; Sin-Yao ; et al. | 2018-12-06 |
Via Support Structure Under Pad Areas For Bsi Bondability Improvement
App 20180350865 - Huang; Sin-Yao ; et al. | 2018-12-06 |
Back-side illuminated (BSI) image sensor with global shutter scheme
Grant 10,147,752 - Chen , et al. De | 2018-12-04 |
Structure for stacked logic performance improvement
Grant 10,147,682 - Kao , et al. De | 2018-12-04 |
Metal Block And Bond Pad Structure
App 20180342552 - Ho; Cheng-Ying ; et al. | 2018-11-29 |
Semiconductor switching device separated by device isolation
Grant 10,141,358 - Kao , et al. Nov | 2018-11-27 |
Pad Structure For Front Side Illuminated Image Sensor
App 20180331146 - Hsu; Kai-Chun ; et al. | 2018-11-15 |
Isolation for semiconductor devices
Grant 10,128,304 - Hsu , et al. November 13, 2 | 2018-11-13 |
Stacked substrate structure with inter-tier interconnection
Grant 10,121,812 - Lin , et al. November 6, 2 | 2018-11-06 |
Biased backside illuminated sensor shield structure
Grant 10,121,821 - Ting , et al. November 6, 2 | 2018-11-06 |
Semiconductor arrangement and formation thereof
Grant 10,103,287 - Hsu , et al. October 16, 2 | 2018-10-16 |
Interconnect structure and method of forming same
Grant 10,092,768 - Tsai , et al. October 9, 2 | 2018-10-09 |
Method and apparatus for image sensor packaging
Grant 10,096,645 - Chen , et al. October 9, 2 | 2018-10-09 |
Interconnect structure for stacked device
Grant 10,096,515 - Tsai , et al. October 9, 2 | 2018-10-09 |
Semiconductor devices, methods of manufacturing thereof, and image sensor devices
Grant 10,090,353 - Chuang , et al. October 2, 2 | 2018-10-02 |
CMOS image sensor chips with stacked scheme and methods for forming the same
Grant 10,090,349 - Wan , et al. October 2, 2 | 2018-10-02 |
Semiconductor Structure And Method For Manufacturing The Same
App 20180277526 - KAO; MIN-FENG ; et al. | 2018-09-27 |
Method for forming alignment marks and structure of same
Grant 10,074,612 - Chou , et al. September 11, 2 | 2018-09-11 |
Apparatus For Reducing Optical Cross-Talk In Image Sensors
App 20180247971 - Lin; Chin-Min ; et al. | 2018-08-30 |
Deep trench isolation fabrication for BSI image sensor
Grant 10,062,720 - Chiang , et al. August 28, 2 | 2018-08-28 |
Elevated photodiode with a stacked scheme
Grant 10,062,721 - Wan , et al. August 28, 2 | 2018-08-28 |
Image sensor device and method
Grant 10,062,728 - Lin , et al. August 28, 2 | 2018-08-28 |
3DIC interconnect apparatus and method
Grant 10,056,353 - Tsai , et al. August 21, 2 | 2018-08-21 |
Through via structure, semiconductor device and manufacturing method thereof
Grant 10,049,981 - Chen , et al. August 14, 2 | 2018-08-14 |
Via support structure under pad areas for BSI bondability improvement
Grant 10,038,025 - Huang , et al. July 31, 2 | 2018-07-31 |
Bond pad structure for bonding improvement
Grant 10,038,026 - Huang , et al. July 31, 2 | 2018-07-31 |
Semiconductor Device Structure With Stacked Semiconductor Dies
App 20180204868 - Kao; Min-Feng ; et al. | 2018-07-19 |
Extra Doped Region For Back-side Deep Trench Isolation
App 20180204862 - Chen; Chun-Yuan ; et al. | 2018-07-19 |
Gate Electrodes with Notches and Methods for Forming the Same
App 20180190494 - Kao; Min-Feng ; et al. | 2018-07-05 |
Stacked SPAD image sensor
Grant 10,014,340 - Yang , et al. July 3, 2 | 2018-07-03 |
Implant isolated devices and method for forming the same
Grant 10,008,532 - Kao , et al. June 26, 2 | 2018-06-26 |
Image Sensing Device
App 20180158850 - WU; Wei-Chuang ; et al. | 2018-06-07 |
Image Sensor Pickup Region Layout
App 20180151613 - Yaung; Dun-Nian ; et al. | 2018-05-31 |
Semiconductor Device Structure And Method For Forming The Same
App 20180151522 - Yang; Ming-Hsien ; et al. | 2018-05-31 |
Method for manufacturing image sensor structure having wide contact
Grant 9,978,805 - Wang , et al. May 22, 2 | 2018-05-22 |
Interconnect Structure For Stacked Device And Method
App 20180130836 - Chuang; Chun-Chieh ; et al. | 2018-05-10 |
Method for reducing optical cross-talk in image sensors
Grant 9,966,412 - Lin , et al. May 8, 2 | 2018-05-08 |
Method and apparatus for image sensor packaging
Grant 9,966,405 - Hsu , et al. May 8, 2 | 2018-05-08 |
Semiconductor Device Structure
App 20180122775 - Kao; Min-Feng ; et al. | 2018-05-03 |
Hybrid bonding with air-gap structure
Grant 9,960,142 - Chen , et al. May 1, 2 | 2018-05-01 |
Extra doped region for back-side deep trench isolation
Grant 9,954,022 - Chen , et al. April 24, 2 | 2018-04-24 |
Vertically Integrated Image Sensor Chips and Methods for Forming the Same
App 20180108703 - Lin; Jeng-Shyan ; et al. | 2018-04-19 |
Design Method for an Image Sensor Device
App 20180108699 - Chen; Chun-Han ; et al. | 2018-04-19 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20180102351 - Tsai; Shu-Ting ; et al. | 2018-04-12 |
Multi-wafer stacking by Ox-Ox bonding
Grant 9,941,249 - Tsai , et al. April 10, 2 | 2018-04-10 |
Deep trench isolation structure in image sensor device
Grant 9,935,147 - Chen , et al. April 3, 2 | 2018-04-03 |
Semiconductor device structure with stacked semiconductor dies
Grant 9,923,011 - Kao , et al. March 20, 2 | 2018-03-20 |
Method and apparatus for image sensor packaging
Grant 9,917,123 - Chen , et al. March 13, 2 | 2018-03-13 |
Through Via Structure, Semiconductor Device And Manufacturing Method Thereof
App 20180068949 - CHEN; HSIN-HUNG ; et al. | 2018-03-08 |
Structure and Method for 3D Image Sensor
App 20180061880 - Kao; Min-Feng ; et al. | 2018-03-01 |
Gate electrodes with notches and methods for forming the same
Grant 9,905,426 - Kao , et al. February 27, 2 | 2018-02-27 |
Phase detection autofocus techniques
Grant 9,905,605 - Hsu , et al. February 27, 2 | 2018-02-27 |
Semiconductor Device Structure
App 20180053756 - HO; CHENG-YING ; et al. | 2018-02-22 |
Full-PDAF (phase detection autofocus) CMOS image sensor structures
Grant 9,893,111 - Chou , et al. February 13, 2 | 2018-02-13 |
3DIC structure and method for hybrid bonding semiconductor wafers
Grant 9,887,182 - Chen , et al. February 6, 2 | 2018-02-06 |
CMOS image sensor and method for forming the same
Grant 9,887,234 - Kao , et al. February 6, 2 | 2018-02-06 |
Mechanisms For Forming Image-sensor Device With Expitaxial Isolation Feature
App 20180033812 - Hsu; Wen-I ; et al. | 2018-02-01 |
3DIC Seal Ring Structure and Methods of Forming Same
App 20180033817 - Ho; Cheng-Ying ; et al. | 2018-02-01 |
Semiconductor device structure and method for forming the same
Grant 9,881,884 - Yang , et al. January 30, 2 | 2018-01-30 |
Image Sensor Device And Method Of Forming Same
App 20180026069 - Wang; Wen-De ; et al. | 2018-01-25 |
Back-side Illuminated (bsi) Image Sensor With Global Shutter Scheme
App 20180026066 - Chen; Chun-Yuan ; et al. | 2018-01-25 |
Integrated Circuit (ic) Structure For High Performance And Functional Density
App 20180025970 - Kao; Min-Feng ; et al. | 2018-01-25 |
Semiconductor device structure
Grant 9,875,989 - Kao , et al. January 23, 2 | 2018-01-23 |
3DIC Interconnect Apparatus and Method
App 20180012870 - Tsai; Shu-Ting ; et al. | 2018-01-11 |
Image sensor pickup region layout
Grant 9,865,630 - Yaung , et al. January 9, 2 | 2018-01-09 |
Interconnect structure for stacked device and method
Grant 9,865,645 - Chuang , et al. January 9, 2 | 2018-01-09 |
Interconnect Structure and Method of Forming Same
App 20180001099 - Tsai; Shu-Ting ; et al. | 2018-01-04 |
Methods and apparatus for glass removal in CMOS image sensors
Grant 9,859,322 - Chen , et al. January 2, 2 | 2018-01-02 |
Image Sensor Device and Method
App 20170373116 - Lin; Jeng-Shyan ; et al. | 2017-12-28 |
Color filter array and micro-lens structure for imaging system
Grant 9,853,082 - Chen , et al. December 26, 2 | 2017-12-26 |
Image sensor devices and design and manufacturing methods thereof
Grant 9,847,364 - Chen , et al. December 19, 2 | 2017-12-19 |
Vertically integrated image sensor chips and methods for forming the same
Grant 9,847,368 - Lin , et al. December 19, 2 | 2017-12-19 |
Backside structure and methods for BSI image sensors
Grant 9,837,464 - Chuang , et al. December 5, 2 | 2017-12-05 |
Image Sensor Device and Method
App 20170330979 - Huang; Kuo-Chin ; et al. | 2017-11-16 |
Method of manufacturing a semiconductor device
Grant 9,818,735 - Ho , et al. November 14, 2 | 2017-11-14 |
Stacked Semiconductor Structure and Method
App 20170323869 - Chen; Szu-Ying ; et al. | 2017-11-09 |
Frontside illuminated (FSI) image sensor with a reflector
Grant 9,812,482 - Kao , et al. November 7, 2 | 2017-11-07 |
Seal ring structure with a metal pad
Grant 9,812,409 - Lin , et al. November 7, 2 | 2017-11-07 |
Structure and method for 3D image sensor
Grant 9,812,487 - Kao , et al. November 7, 2 | 2017-11-07 |
Back-side illuminated (BSI) image sensor with global shutter scheme
Grant 9,812,483 - Chen , et al. November 7, 2 | 2017-11-07 |
3DIC seal ring structure and methods of forming same
Grant 9,806,119 - Ho , et al. October 31, 2 | 2017-10-31 |
3DIC Structure and Method for Hybrid Bonding Semiconductor Wafers
App 20170309603 - Chen; Ju-Shi ; et al. | 2017-10-26 |
Semiconductor Switching Device Separated by Device Isolation
App 20170309672 - Kao; Min-Feng ; et al. | 2017-10-26 |
Method For Reducing Optical Cross-Talk In Image Sensors
App 20170309675 - Lin; Chin-Min ; et al. | 2017-10-26 |
Full-pdaf (phase Detection Autofocus) Cmos Image Sensor Structures
App 20170301718 - Chou; Keng-Yu ; et al. | 2017-10-19 |
Deep Trench Isolation Fabrication For Bsi Image Sensor
App 20170301709 - Chiang; Yen-Ting ; et al. | 2017-10-19 |
Integrated circuit structure and method of forming the same
Grant 9,786,592 - Lin , et al. October 10, 2 | 2017-10-10 |
Hybrid Bond Pad Structure
App 20170287878 - Huang; Sin-Yao ; et al. | 2017-10-05 |
Mechanisms for forming image-sensor device with epitaxial isolation feature
Grant 9,780,137 - Hsu , et al. October 3, 2 | 2017-10-03 |
Image sensor device and method of forming same
Grant 9,773,828 - Wang , et al. September 26, 2 | 2017-09-26 |
Implant Isolated Devices and Method for Forming the Same
App 20170271386 - Kao; Min-Feng ; et al. | 2017-09-21 |
Image sensor including multiple lenses and method of manufacture thereof
Grant 9,768,224 - Hsu , et al. September 19, 2 | 2017-09-19 |
Interconnect structure and method of forming same
Grant 9,764,153 - Tsai , et al. September 19, 2 | 2017-09-19 |
Semiconductor Devices, Methods of Manufacturing Thereof, and Image Sensor Devices
App 20170263667 - Chuang; Chun-Chieh ; et al. | 2017-09-14 |
Mechanisms For Forming Image Sensor Device With Deep-trench Isolation Structure
App 20170263659 - LIN; Jeng-Shyan ; et al. | 2017-09-14 |
Image sensor device and method
Grant 9,761,629 - Yaung , et al. September 12, 2 | 2017-09-12 |
3DIC interconnect apparatus and method
Grant 9,754,925 - Tsai , et al. September 5, 2 | 2017-09-05 |
Pad Structure Exposed In An Opening Through Multiple Dielectric Layers In Bsi Image Sensor Chips
App 20170250215 - Lin; Jeng-Shyan ; et al. | 2017-08-31 |
Image sensor devices, methods of manufacture thereof, and semiconductor device manufacturing methods
Grant 9,748,304 - Chen , et al. August 29, 2 | 2017-08-29 |
Alignment marks in non-STI isolation formation and methods of forming the same
Grant 9,741,665 - Chang , et al. August 22, 2 | 2017-08-22 |
Method of Manufacturing Image Sensor Having Enhanced Backside Illumination Quantum Efficiency
App 20170236863 - Liao; Yin-Kai ; et al. | 2017-08-17 |
Hybrid bond using a copper alloy for yield improvement
Grant 9,728,521 - Tsai , et al. August 8, 2 | 2017-08-08 |
Deep trench isolation fabrication for BSI image sensor
Grant 9,728,570 - Chiang , et al. August 8, 2 | 2017-08-08 |
Metal Block and Bond Pad Structure
App 20170221950 - Ho; Cheng-Ying ; et al. | 2017-08-03 |
Image sensor device and method
Grant 9,722,109 - Huang , et al. August 1, 2 | 2017-08-01 |
Stacked semicondcutor structure and method
Grant 9,716,078 - Chen , et al. July 25, 2 | 2017-07-25 |
Method for Forming Alignment Marks and Structure of Same
App 20170207176 - Chou; Cheng-Hsien ; et al. | 2017-07-20 |
Biased Backside Illuminated Sensor Shield Structure
App 20170207261 - Ting; Shyh-Fann ; et al. | 2017-07-20 |
Method For Manufacturing Image Sensor Structure Having Wide Contact
App 20170200763 - WANG; Tzu-Jui ; et al. | 2017-07-13 |
Semiconductor Device Structure With Stacked Semiconductor Dies
App 20170200756 - KAO; Min-Feng ; et al. | 2017-07-13 |
Semiconductor Device Structure
App 20170200697 - KAO; Min-Feng ; et al. | 2017-07-13 |
Stacked Spad Image Sensor
App 20170186798 - Yang; Ming-Hsien ; et al. | 2017-06-29 |
Frontside Illuminated (fsi) Image Sensor With A Reflector
App 20170186796 - Kao; Min-Feng ; et al. | 2017-06-29 |
Stacked Substrate Structure With Inter-tier Interconnection
App 20170186799 - Lin; Jeng-Shyan ; et al. | 2017-06-29 |
Via Support Structure Under Pad Areas For Bsi Bondability Improvement
App 20170186802 - Huang; Sin-Yao ; et al. | 2017-06-29 |
Backside Structure and Methods for BSI Image Sensors
App 20170162622 - Chuang; Chun-Chieh ; et al. | 2017-06-08 |
Structure For Stacked Logic Performance Improvement
App 20170154850 - Kao; Min-Feng ; et al. | 2017-06-01 |
Back Side Illuminated Image Sensor with Reduced Sidewall-Induced Leakage
App 20170154918 - Tsai; Shuang-Ji ; et al. | 2017-06-01 |
Dti For Bsi Image Sensor
App 20170133414 - Chiang; Yen-Ting ; et al. | 2017-05-11 |
Image Sensor With Wide Contact
App 20170125473 - WANG; Tzu-Jui ; et al. | 2017-05-04 |
Integrated Circuit Structure And Method Of Forming The Same
App 20170125341 - LIN; Jeng-Shyan ; et al. | 2017-05-04 |
Extra Doped Region For Back-side Deep Trench Isolation
App 20170117309 - Chen; Chun-Yuan ; et al. | 2017-04-27 |
Back-side Illuminated (bsi) Image Sensor With Global Shutter Scheme
App 20170117315 - Chen; Chun-Yuan ; et al. | 2017-04-27 |
Pad Structure For Front Side Illuminated Image Sensor
App 20170117316 - Hsu; Kai-Chun ; et al. | 2017-04-27 |
Phase Detection Autofocus Techniques
App 20170110501 - Hsu; Wen-I ; et al. | 2017-04-20 |
Interconnect Apparatus and Method
App 20170110496 - Lin; Jeng-Shyan ; et al. | 2017-04-20 |
Hybrid Bond Pad Structure
App 20160379960A1 - | 2016-12-29 |
Bond Pad Structure For Bonding Improvement
App 20160379962A1 - | 2016-12-29 |
Multi-Wafer Stacking by Ox-Ox Bonding
App 20160379963A1 - | 2016-12-29 |
| 