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Patent applications and USPTO patent grants for Yau; You-Wen.The latest application filed is for "stacked redistribution layers on die".
Patent | Date |
---|---|
Stacked redistribution layers on die Grant 9,171,782 - Hau-Riege , et al. October 27, 2 | 2015-10-27 |
Stacked Redistribution Layers On Die App 20150041982 - Hau-Riege; Christine Sung-An ;   et al. | 2015-02-12 |
Circuit And Method For Testing Insulating Material App 20120212245 - Pinto; Angelo ;   et al. | 2012-08-23 |
Production and packaging control for repaired integrated circuits Grant 7,521,266 - Tseng , et al. April 21, 2 | 2009-04-21 |
Production and packaging control for repaired integrated circuits App 20070111402 - Tseng; Shu-Jung ;   et al. | 2007-05-17 |
High accuracy, high flexibility, energy beam machining system Grant 5,171,964 - Booke , et al. December 15, 1 | 1992-12-15 |
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