YASUI; Seiji
Patent Applications and Registrations
Patent applications and USPTO patent grants for YASUI; Seiji.The latest application filed is for "inverter unit".
- YASUI; Seiji - Anjo-shi JP
- Yasui; Seiji - Nagoya-shi JP
- YASUI; Seiji - Nagoya JP
- Yasui; Seiji - Handa JP
- Yasui, Seiji - Handa-City JP
- Yasui; Seiji - Kobe JP
| Patent | Date |
|---|---|
| Inverter Unit App 20210344295 - HOTTA; Yutaka ; et al. | 2021-11-04 |
| Connection Terminal And Circuit Component App 20130171891 - Tsuruoka; Junji ; et al. | 2013-07-04 |
| Semiconductor Device And Manufacturing Method Of Semiconductor Device App 20130113120 - TSURUOKA; Junji ; et al. | 2013-05-09 |
| Semiconductor Device App 20130105985 - TSURUOKA; Junji ; et al. | 2013-05-02 |
| Connection Terminal And Circuit Component App 20120118635 - TSURUOKA; Junji ; et al. | 2012-05-17 |
| Semiconductor module and inverter device Grant 7,859,103 - Aoki , et al. December 28, 2 | 2010-12-28 |
| Semiconductor module and inverter device Grant 7,760,503 - Aoki , et al. July 20, 2 | 2010-07-20 |
| Semiconductor module and inverter device Grant 7,755,898 - Aoki , et al. July 13, 2 | 2010-07-13 |
| Heat generating member cooling structure and drive unit Grant 7,728,467 - Aoki , et al. June 1, 2 | 2010-06-01 |
| Electric circuit device and the manufacturing method Grant 7,663,886 - Aoki , et al. February 16, 2 | 2010-02-16 |
| Heating element cooling structure and drive device having the cooling structure Grant 7,569,957 - Aoki , et al. August 4, 2 | 2009-08-04 |
| Semiconductor module and inverter device App 20080291628 - Aoki; Kazuo ; et al. | 2008-11-27 |
| Semiconductor module and inverter device App 20080290506 - Aoki; Kazuo ; et al. | 2008-11-27 |
| Semiconductor module and inverter device App 20080291710 - Aoki; Kazuo ; et al. | 2008-11-27 |
| Heat spreader module Grant 7,433,187 - Ishikawa , et al. October 7, 2 | 2008-10-07 |
| Heat generating member cooling structure and drive unit App 20080179972 - Aoki; Kazuo ; et al. | 2008-07-31 |
| Heating element cooling structure and drive device having the cooling structure App 20080169088 - Aoki; Kazuo ; et al. | 2008-07-17 |
| Electric circuit device and the manufacturing method App 20080158824 - Aoki; Kazuo ; et al. | 2008-07-03 |
| Composite material Grant 6,953,539 - Ishikawa , et al. October 11, 2 | 2005-10-11 |
| Heat sink material and method of manufacturing the heat sink material Grant 6,933,531 - Ishikawa , et al. August 23, 2 | 2005-08-23 |
| Heat sink material Grant 6,927,421 - Ishikawa , et al. August 9, 2 | 2005-08-09 |
| Heat spreader module and method of manufacturing same App 20040191558 - Ishikawa, Takahiro ; et al. | 2004-09-30 |
| Heat sink material App 20030082393 - Ishikawa, Shuhei ; et al. | 2003-05-01 |
| Composite material App 20030054188 - Ishikawa, Shuhei ; et al. | 2003-03-20 |
| Method of metering molding compound and a metering system for carrying out the same Grant 5,238,147 - Yasui , et al. August 24, 1 | 1993-08-24 |
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