Yasuda; Suguru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yasuda; Suguru.The latest application filed is for "wiring member".
- Yasuda; Suguru - Mie JP
| Patent | Date |
|---|---|
| Wiring member Grant 11,443,869 - Matsuo , et al. September 13, 2 | 2022-09-13 |
| Wiring Member App 20220246325 - SUMIDA; Shintaro ; et al. | 2022-08-04 |
| Wiring Member App 20220246324 - SUMIDA; Shintaro ; et al. | 2022-08-04 |
| Wiring Member App 20220234526 - SUMIDA; Shintaro ; et al. | 2022-07-28 |
| Wiring Member App 20220215984 - SUMIDA; Shintaro ; et al. | 2022-07-07 |
| Wiring Member App 20220212614 - SUMIDA; Shintaro ; et al. | 2022-07-07 |
| Wiring Member App 20220199288 - SUMIDA; Shintaro ; et al. | 2022-06-23 |
| Wiring Member App 20220199290 - YASUDA; Suguru ; et al. | 2022-06-23 |
| Wiring Member App 20220181044 - YASUDA; Suguru ; et al. | 2022-06-09 |
| Wiring Member With Exterior Member And Manufacturing Method Of Wiring Member With Exterior Member App 20220134972 - NISHIMURA; Tetsuya ; et al. | 2022-05-05 |
| Wiring Member App 20220139594 - NAKANO; Haruka ; et al. | 2022-05-05 |
| Wiring Member And Arrangement Structure Of Wiring Member App 20220076862 - NAKANO; Haruka ; et al. | 2022-03-10 |
| Wiring Member App 20220068520 - TAKAKURA; Ryuta ; et al. | 2022-03-03 |
| Wiring Member And Wiring Member In Packaged Form App 20220024393 - NISHIMURA; Tetsuya ; et al. | 2022-01-27 |
| Wiring Member App 20220029396 - ISHIDA; Hidetoshi ; et al. | 2022-01-27 |
| Wiring Member App 20220028577 - NAKANO; Haruka ; et al. | 2022-01-27 |
| Wiring Member And Wiring Member In Packaged Form App 20220029400 - ISHIDA; Hidetoshi ; et al. | 2022-01-27 |
| Wiring Member App 20220014002 - NISHIMURA; Tetsuya ; et al. | 2022-01-13 |
| Stacked wiring member Grant 11,183,317 - Ebata , et al. November 23, 2 | 2021-11-23 |
| Wiring Member App 20210273378 - HIRAI; Hiroki ; et al. | 2021-09-02 |
| Wiring Member App 20210210249 - MATSUO; Yuki ; et al. | 2021-07-08 |
| Stacked Wiring Member App 20210193349 - EBATA; Daisuke ; et al. | 2021-06-24 |
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