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name:-0.0033369064331055
name:-0.0048239231109619
name:-0.0013420581817627
Yasuda; Kyouyu Patent Filings

Yasuda; Kyouyu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yasuda; Kyouyu.The latest application filed is for "hot melt adhesive composition".

Company Profile
0.3.2
  • Yasuda; Kyouyu - Tokyo JP
  • Yasuda; Kyouyu - Tsu JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Hot melt adhesive composition
App 20070135543 - Yasuda; Kyouyu ;   et al.
2007-06-14
Photocuring resin composition, medical device using same and method for manufacturing same
App 20070082965 - Yasuda; Kyouyu ;   et al.
2007-04-12
Liquid crystal alignment agent
Grant 5,969,055 - Nishikawa , et al. October 19, 1
1999-10-19
Polyamic acid, polyimide and liquid crystal aligning agent
Grant 5,783,656 - Kimura , et al. July 21, 1
1998-07-21
Liquid crystal orienting agent
Grant 5,700,860 - Nishikawa , et al. December 23, 1
1997-12-23

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