Yashiro; Akira

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yashiro; Akira.The latest application filed is for "heating device and image forming apparatus".

Company Profile

0.16.13

Yashiro; Akira - Osaka JP
Yashiro; Akira - Ikeda JP
YASHIRO; Akira - Ikeda City JP
Yashiro; Akira - Kanagawa JP
Yashiro; Akira - Atsugi JP
Yashiro, Akira - Atsugi-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heating device and image forming apparatus Grant 9,709,933 - Hayashi , et al. July 18, 2	2017-07-18
Heating Device And Image Forming Apparatus App 20160266526 - HAYASHI; Takashi ; et al.	2016-09-15
Image forming apparatus and image forming method Grant 9,128,422 - Yashiro , et al. September 8, 2	2015-09-08
Image Forming Apparatus And Image Forming Method App 20140270864 - YASHIRO; Akira ; et al.	2014-09-18
Power supply circuit, image forming apparatus incorporating same, and power supply method to supply voltage to image forming apparatus Grant 8,837,975 - Komai , et al. September 16, 2	2014-09-16
Image forming apparatus and image forming control method which calculates a remaining lifetime Grant 8,699,893 - Yashiro April 15, 2	2014-04-15
Power Supply Circuit, Image Forming Apparatus Incorporating Same, And Power Supply Method To Supply Voltage To Image Forming Apparatus App 20130164017 - KOMAI; Kunihiro ; et al.	2013-06-27
Power source unit and image forming apparatus Grant 8,422,905 - Yashiro April 16, 2	2013-04-16
Image Forming Apparatus And Image Forming Control Method App 20120070161 - YASHIRO; Akira	2012-03-22
Power Source Unit And Image Forming Apparatus App 20110064445 - YASHIRO; Akira	2011-03-17
Power supply apparatus and image forming apparatus Grant 7,761,017 - Yashiro July 20, 2	2010-07-20
Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths Grant 7,598,621 - Yashiro October 6, 2	2009-10-06
Wiring layout of auxiliary wiring package and printed circuit wiring board Grant 7,525,817 - Yashiro April 28, 2	2009-04-28
Device Package, A Printed Wiring Board, And An Electronic Apparatus With Efficiently Spaced Bottom Electrodes Including Intervals Between Bottom Electrodes Of Different Lengths App 20080150169 - Yashiro; Akira	2008-06-26
Power supply apparatus and image forming apparatus App 20080138099 - Yashiro; Akira	2008-06-12
Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths Grant 7,361,997 - Yashiro April 22, 2	2008-04-22
Device package, a printed wiring board, and an electronic apparatus App 20050127520 - Yashiro, Akira	2005-06-16
Wiring layout auxiliary wiring package and printed circuit wiring board App 20050121228 - Yashiro, Akira	2005-06-09
Wiring layout of auxiliary wiring package and printed circuit wiring board Grant 6,862,192 - Yashiro March 1, 2	2005-03-01
Wiring layout of auxiliary wiring package and printed circuit wiring board App 20040002206 - Yashiro, Akira	2004-01-01
Complementary wiring package and method for mounting a semi-conductive IC package in a high-density board Grant 6,104,088 - Hatano , et al. August 15, 2	2000-08-15

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