Yap; Liop Jin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yap; Liop Jin.The latest application filed is for "multi-package conversion kit for a pick and place handler".

Company Profile

0.4.4

Yap; Liop Jin - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-package conversion kit for a pick and place handler Grant 7,076,861 - Sum , et al. July 18, 2	2006-07-18
Testing of BGA and other CSP packages using probing techniques Grant 6,791,346 - Mehta , et al. September 14, 2	2004-09-14
Multi-package conversion kit for a pick and place handler App 20040134054 - Sum, Kai Wah ; et al.	2004-07-15
Robust universal docking system App 20020145438 - Ramesh, Ramamoorthi ; et al.	2002-10-10
Testing of BGA and other CSP packages using probing techniques App 20020125908 - Mehta, Rajiv ; et al.	2002-09-12
Testing of BGA and other CSP packages using probing techniques App 20020125909 - Mehta, Rajiv ; et al.	2002-09-12
Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system Grant 6,300,781 - Yap , et al. October 9, 2	2001-10-09
Device probe socket forming part of a test head, interfacing between test head and a probe handler, used for device strip testing Grant 6,242,933 - Yap June 5, 2	2001-06-05

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