Yap; Fung Ling
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yap; Fung Ling.The latest application filed is for "an imprinted polymeric substrate".
- Yap; Fung Ling - Singapore SG
- Yap; Fung Ling - Geyland East Central SG
- Yap; Fung Ling - Geylang East Central SG
| Patent | Date |
|---|---|
| Adhesive having increased bonding strength Grant 11,434,394 - Yap , et al. September 6, 2 | 2022-09-06 |
| An Imprinted Polymeric Substrate App 20210170667 - Lee; Yeong Yuh ; et al. | 2021-06-10 |
| Adhesive Having Increased Bonding Strength App 20200270482 - Yap; Fung Ling ; et al. | 2020-08-27 |
| Water Soluble Pouch Comprising An Embossed Area App 20150360837 - PEREZ-PRAT VINUESA; Eva Maria ; et al. | 2015-12-17 |
| Organic material-based graphitic material Grant 8,957,406 - Sokolov , et al. February 17, 2 | 2015-02-17 |
| Organic Material-based Graphitic Material App 20140103297 - Sokolov; Anatoliy N. ; et al. | 2014-04-17 |
| Methods To Form Substrates For Optical Sensing By Surface Enhanced Raman Spectroscopy (sers) And Substrates Formed By The Methods App 20130045877 - Yap; Fung Ling ; et al. | 2013-02-21 |
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