Yap; Eng Hooi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yap; Eng Hooi.The latest application filed is for "solder printing process to reduce void formation in a microvia".
- Yap; Eng Hooi - Penang MY
- Yap; Eng Hooi - Bukit Mertajam MY
| Patent | Date |
|---|---|
| Solder printing process to reduce void formation in a microvia Grant 7,789,285 - Tay , et al. September 7, 2 | 2010-09-07 |
| Thermal interface apparatus, systems, and methods Grant 7,400,040 - Yap , et al. July 15, 2 | 2008-07-15 |
| Solder printing process to reduce void formation in a microvia App 20080099539 - Tay; Cheng Siew ; et al. | 2008-05-01 |
| Solder printing process to reduce void formation in a microvia Grant 7,331,503 - Tay , et al. February 19, 2 | 2008-02-19 |
| Solder printing process to reduce void formation in a microvia App 20060091188 - Tay; Cheng Siew ; et al. | 2006-05-04 |
| Thermal interface apparatus, systems, and methods App 20040256720 - Yap, Eng Hooi ; et al. | 2004-12-23 |
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