YAP; Chiew Wah

Patent Applications and Registrations

Patent applications and USPTO patent grants for YAP; Chiew Wah.The latest application filed is for "substrate processing method and substrate processing apparatus".

Company Profile

2.4.6

YAP; Chiew Wah - Singapore SG
Yap; Chiew Wah - S'pore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate Processing Method And Substrate Processing Apparatus App 20210265170 - WATANABE; Seiichi ; et al.	2021-08-26
Methods of forming integrated circuits with solutions to interlayer dielectric void formation between gate structures Grant 10,566,441 - Nong , et al. Feb	2020-02-18
Methods Of Forming Integrated Circuits With Solutions To Interlayer Dielectric Void Formation Between Gate Structures App 20190252515 - Nong; Hao ; et al.	2019-08-15
Methods For Fabricating Integrated Circuits With Nonvolatile Memory Devices App 20150349095 - Yap; Chiew Wah ; et al.	2015-12-03
Integrated Circuit System Including Nitride Layer Technology App 20130034954 - Nagarad; Sripad Sheshagiri ; et al.	2013-02-07
Integrated circuit system including nitride layer technology Grant 8,283,263 - Nagarad , et al. October 9, 2	2012-10-09
Integrated Circuit System Including Nitride Layer Technology App 20080032513 - Nagarad; Sripad Sheshagiri ; et al.	2008-02-07
Method of forming almost L-shaped spacer for improved ILD gap fill Grant 6,632,745 - Yap , et al. October 14, 2	2003-10-14
Method for forming an L-shaped spacer with a disposable organic top coating Grant 6,294,480 - Pradeep , et al. September 25, 2	2001-09-25

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