Yao, Tse-Yong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yao, Tse-Yong.The latest application filed is for "barrier layer for electroplating processes".

Company Profile

0.7.4

Yao, Tse-Yong - San Francisco CA
Yao, Tse-Yong - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Barrier layer for electroplating processes App 20050031784 - Ding, Peijun ; et al.	2005-02-10
Barrier layer for electroplating processes Grant 6,790,776 - Ding , et al. September 14, 2	2004-09-14
Temperature control of a substrate Grant 6,607,640 - Sundarrajan , et al. August 19, 2	2003-08-19
Barrier layer for electroplating processes App 20020092772 - Ding, Peijun ; et al.	2002-07-18
Apparatus for filling apertures in a film layer on a semiconductor structure App 20020089027 - Xu, Zheng ; et al.	2002-07-11
Barrier layer for electroplating processes Grant 6,328,871 - Ding , et al. December 11, 2	2001-12-11
Temperature Control of a substrate App 20010025783 - Sundarrajan, Arvind ; et al.	2001-10-04
Filling narrow apertures and forming interconnects with a metal utilizing a crystallographically oriented liner layer Grant 6,217,721 - Xu , et al. April 17, 2	2001-04-17
High pressure copper fill at low temperature Grant 6,140,235 - Yao , et al. October 31, 2	2000-10-31
Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition Grant 6,051,114 - Yao , et al. April 18, 2	2000-04-18
Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches Grant 5,962,923 - Xu , et al. October 5, 1	1999-10-05

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