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Yao; Jin-zhong Patent Filings

Yao; Jin-zhong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yao; Jin-zhong.The latest application filed is for "method of forming premolded lead frame".

Company Profile
0.2.2
  • Yao; Jin-zhong - Tianjin CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of forming premolded lead frame
Grant 7,723,163 - Xu , et al. May 25, 2
2010-05-25
Flip chip and wire bond semiconductor package
Grant 7,554,185 - Foong , et al. June 30, 2
2009-06-30
Method Of Forming Premolded Lead Frame
App 20090098686 - Xu; Xue-song ;   et al.
2009-04-16
Flip Chip And Wire Bond Semiconductor Package
App 20080111248 - Foong; Chee Seng ;   et al.
2008-05-15

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