| Patent | Date |
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Method for depositing a diffusion barrier layer and a metal conductive layer
Grant 9,991,157 - Chiang , et al. June 5, 2 | 2018-06-05 |
Method For Depositing A Diffusion Barrier Layer And A Metal Conductive Layer
App 20160322255 - CHIANG; Tony ; et al. | 2016-11-03 |
Method for depositing a diffusion barrier layer and a metal conductive layer
Grant 9,390,970 - Chiang , et al. July 12, 2 | 2016-07-12 |
Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features
Grant 8,158,511 - Chiang , et al. April 17, 2 | 2012-04-17 |
Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features
App 20110256716 - Chiang; Tony ; et al. | 2011-10-20 |
Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features
Grant 7,989,343 - Chiang , et al. August 2, 2 | 2011-08-02 |
Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features
App 20100255678 - Chiang; Tony ; et al. | 2010-10-07 |
Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate
Grant 7,795,138 - Chiang , et al. September 14, 2 | 2010-09-14 |
Metal / metal nitride barrier layer for semiconductor device applications
Grant 7,687,909 - Ding , et al. March 30, 2 | 2010-03-30 |
Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate
App 20090269922 - Chiang; Tony ; et al. | 2009-10-29 |
Method of depositing a sculptured copper seed layer
Grant 7,589,016 - Chiang , et al. September 15, 2 | 2009-09-15 |
Method of depositing a diffusion barrier layer which provides an improved interconnect
App 20090053888 - Ding; Peijun ; et al. | 2009-02-26 |
Method of depositing a sculptured copper seed layer
App 20080166869 - Chiang; Tony ; et al. | 2008-07-10 |
Method of depositing a metal seed layer on semiconductor substrates
Grant 7,381,639 - Chiang , et al. June 3, 2 | 2008-06-03 |
Metal / metal nitride barrier layer for semiconductor device applications
App 20070241458 - Ding; Peijun ; et al. | 2007-10-18 |
Method of depositing a tantalum nitride/tantalum diffusion barrier layer system
Grant 7,253,109 - Ding , et al. August 7, 2 | 2007-08-07 |
Damage-free sculptured coating deposition
App 20070178682 - Chiang; Tony ; et al. | 2007-08-02 |
Method of depositing a metal seed layer on semiconductor substrates
App 20070020922 - Chiang; Tony ; et al. | 2007-01-25 |
Method of depositing a metal seed layer on semiconductor substrates
Grant 7,074,714 - Chiang , et al. July 11, 2 | 2006-07-11 |
Method of depositing low resistivity barrier layers for copper interconnects
App 20050272254 - Ding, Peijun ; et al. | 2005-12-08 |
Method of depositing a tantalum nitride / tantalum diffusion barrier layer system
App 20050208767 - Ding, Peijun ; et al. | 2005-09-22 |
Selective deposition of a barrier layer on a dielectric material
Grant 6,939,801 - Chung , et al. September 6, 2 | 2005-09-06 |
Method of preventing diffusion of copper through a tantalum-comprising barrier layer
Grant 6,919,275 - Chiang , et al. July 19, 2 | 2005-07-19 |
Method and apparatus for cleaning substrates
Grant 6,908,865 - Kranz , et al. June 21, 2 | 2005-06-21 |
Method of depositing a metal seed layer on semiconductor substrates
App 20050085068 - Chiang, Tony ; et al. | 2005-04-21 |
Method of depositing a diffusion barrier layer and a metal conductive layer
App 20050020080 - Chiang, Tony ; et al. | 2005-01-27 |
Method of preventing diffusion of copper through a tantalum-comprising barrier layer
App 20040171250 - Chiang, Tony ; et al. | 2004-09-02 |
Damage-free sculptured coating deposition
Grant 6,758,947 - Chiang , et al. July 6, 2 | 2004-07-06 |
Selective deposition of a barrier layer on a dielectric material
App 20030224578 - Chung, Hua ; et al. | 2003-12-04 |
Apparatus and method for improving throughput in a cluster tool for semiconductor wafer processing
App 20030131458 - Wang, Hougong ; et al. | 2003-07-17 |
Method and apparatus for cleaning substrates
App 20030062333 - Kranz, Martin ; et al. | 2003-04-03 |
Liner materials
Grant 6,528,180 - Lee , et al. March 4, 2 | 2003-03-04 |
Integrated barrier layer structure for copper contact level metallization
App 20020192948 - Chen, Fusen ; et al. | 2002-12-19 |
Method of obtaining low temperature alpha-ta thin films using wafer bias
App 20020142589 - Sundarrajan, Arvind ; et al. | 2002-10-03 |
Method and apparatus for enhancing sidewall coverage during sputtering in a chamber having an inductively coupled plasma
Grant 6,451,179 - Xu , et al. September 17, 2 | 2002-09-17 |
Tailoring of a wetting/barrier layer to reduce electromigration in an aluminum interconnect
Grant 6,383,915 - Su , et al. May 7, 2 | 2002-05-07 |
Damage-free sculptured coating deposition
App 20020029958 - Chiang, Tony ; et al. | 2002-03-14 |
Reflow chamber and process
Grant 6,299,689 - Wang , et al. October 9, 2 | 2001-10-09 |
Barrier applications for aluminum planarization
App 20010005629 - Singhvi, Shri ; et al. | 2001-06-28 |
Integrated PVD system for aluminum hole filling using ionized metal adhesion layer
Grant 6,238,533 - Satitpunwaycha , et al. May 29, 2 | 2001-05-29 |
Barrier applications for aluminum planarization
Grant 6,207,558 - Singhvi , et al. March 27, 2 | 2001-03-27 |
Method for forming titanium silicide in situ
Grant 6,110,821 - Kohara , et al. August 29, 2 | 2000-08-29 |
Central coil design for ionized metal plasma deposition
Grant 6,077,402 - Hong , et al. June 20, 2 | 2000-06-20 |
Aluminum hole filling method using ionized metal adhesion layer
Grant 6,045,666 - Satitpunwaycha , et al. April 4, 2 | 2000-04-04 |
Oxygen enhancement of ion metal plasma (IMP) sputter deposited barrier layers
Grant 5,985,759 - Kim , et al. November 16, 1 | 1999-11-16 |
Silicon-doped titanium wetting layer for aluminum plug
Grant 5,911,113 - Yao , et al. June 8, 1 | 1999-06-08 |
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