Yankee; Sally J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yankee; Sally J..The latest application filed is for "copper to aluminum interlayer interconnect using stud and via liner".
- Yankee; Sally J. - Underhill VT
| Patent | Date |
|---|---|
| Copper to aluminum interlayer interconnect using stud and via liner Grant 7,087,997 - Burrell , et al. August 8, 2 | 2006-08-08 |
| Copper to aluminum interlayer interconnect using stud and via liner Grant 7,037,824 - Burrell , et al. May 2, 2 | 2006-05-02 |
| Copper to aluminum interlayer interconnect using stud and via liner App 20040207092 - Burrell, Lloyd G. ; et al. | 2004-10-21 |
| Heat dissipation from IC interconnects Grant 6,798,066 - Motsiff , et al. September 28, 2 | 2004-09-28 |
| Recessed bond pad Grant 6,650,021 - Stamper , et al. November 18, 2 | 2003-11-18 |
| Copper to aluminum interlayer interconnect using stud and via liner App 20020127846 - Burrell, Lloyd G. ; et al. | 2002-09-12 |
| Recessed bond pad Grant 6,420,254 - Stamper , et al. July 16, 2 | 2002-07-16 |
| Recessed bond pad App 20020053746 - Stamper, Anthony K. ; et al. | 2002-05-09 |
| Recessed bond pad App 20020053740 - Stamper, Anthony K. ; et al. | 2002-05-09 |
| Recessed bond pad Grant 6,362,531 - Stamper , et al. March 26, 2 | 2002-03-26 |
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