Yang; Zhongqiang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Zhongqiang.The latest application filed is for "resin composition, prepreg containing same, laminate, and printed circuit board".

Company Profile

4.11.17

Yang; Zhongqiang - Dongguan CN
YANG; Zhongqiang - Guangdong CN
YANG; Zhongqiang - Dongguan city Guangdong
YANG; Zhongqiang - Guanngdong CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board Grant 11,377,551 - Su , et al. July 5, 2	2022-07-05
Resin Composition, Prepreg Containing Same, Laminate, And Printed Circuit Board App 20220153989 - HE; Liexiang ; et al.	2022-05-19
Resin Composition, Prepreg Containing Same, And Laminate Board And Printed Circuit Board App 20220135788 - HE; Liexiang ; et al.	2022-05-05
Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board Grant 11,319,397 - Su , et al. May 3, 2	2022-05-03
Circuit board and process for preparing the same Grant 11,191,158 - Yan , et al. November 30, 2	2021-11-30
Thermosetting Resin Composition, Prepreg Made Therefrom, Laminate Clad With Metal Foil, And High-frequency Circuit Board App 20200224026 - SU; Minshe ; et al.	2020-07-16
Thermosetting Resin Composition, Prepreg Made Therefrom, Laminate Clad With Metal Foil, And High-frequency Circuit Board App 20200207899 - SU; Minshe ; et al.	2020-07-02
Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the same Grant 10,494,502 - You , et al. De	2019-12-03
Siloxane-modified cyclotriphosphazene halogen-free flame retardant, preparation process and use thereof Grant 10,400,173 - Wang , et al. Sep	2019-09-03
Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereof Grant 10,400,058 - Deng , et al. Sep	2019-09-03
Composite, High-frequency Circuit Substrate Prepared Therefrom And Process For Preparing The Same App 20180263115 - SU; Minshe ; et al.	2018-09-13
Halogen-free Thermosetting Resin Composition, Prepreg And Laminate For Printed Circuit Boards Using The Same App 20180126701 - YOU; Jiang ; et al.	2018-05-10
Siloxane-modified Cyclotriphosphazene Halogen-free Flame Retardant, Preparation Process And Use Thereof App 20180112133 - WANG; Yongzhen ; et al.	2018-04-26
Halogen-free Thermosetting Resin Composition, Prepreg, Laminate And Printed Circuit Board Comprising The Same App 20180086895 - YOU; Jiang ; et al.	2018-03-29
Degradable Resin Composition, and Prepreg, Laminate and Copper Clad Laminate Using Same, and Degrading method thereof App 20170321001 - DENG; Huayang ; et al.	2017-11-09
Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same Grant 9,752,028 - You , et al. September 5, 2	2017-09-05
Circuit Board and Process for Preparing the Same App 20170238417 - YAN; Shanyin ; et al.	2017-08-17
Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same Grant 9,611,377 - You , et al. April 4, 2	2017-04-04
Epoxy resin composition and copper clad laminate manufactured by using same Grant 9,475,970 - Du , et al. October 25, 2	2016-10-25
Halogen-free Thermosetting Resin Composition, And Prepreg And Laminate For Printed Circuits Using The Same App 20160185939 - You; Jiang ; et al.	2016-06-30
Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the Same App 20160185953 - You; Jiang ; et al.	2016-06-30
Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the Same App 20160185952 - You; Jiang ; et al.	2016-06-30
Circuit Substrate And Process For Preparing The Same App 20160007452 - YAN; Shanyin ; et al.	2016-01-07
Thermoset resin composition and its use Grant 9,193,858 - Su , et al. November 24, 2	2015-11-24
Thermoset Resin Composition And Its Use App 20140107256 - SU; Minshe ; et al.	2014-04-17
Epoxy Resin Composition And Copper Clad Laminate Manufactured By Using Same App 20130295388 - Du; Cuiming ; et al.	2013-11-07

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