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Conductive receptacle collar for desense mitigation
Grant 11,329,414 - Zhang , et al. May 10, 2 | 2022-05-10 |
Conductive Receptacle Collar for Desense Mitigation
App 20220077617 - Zhang; Yichi ; et al. | 2022-03-10 |
Shield For Preventing Interference From Electrical Connector
App 20200350733 - Yang; Zhiping ; et al. | 2020-11-05 |
Capacitive sensing array having electrical isolation
Grant 10,628,654 - Yang , et al. | 2020-04-21 |
Capacitive Sensing Array Having Electrical Isolation
App 20190266375 - Yang; Zhiping ; et al. | 2019-08-29 |
Capacitive sensing array having electrical isolation
Grant 10,296,773 - Yang , et al. | 2019-05-21 |
Methods and apparatus for equalization of a high speed serial bus
Grant 10,002,101 - Wu , et al. June 19, 2 | 2018-06-19 |
Systems and methods for high-speed, low-profile memory packages and pinout designs
Grant 9,853,016 - Fai , et al. December 26, 2 | 2017-12-26 |
Systems And Methods For High-speed, Low-profile Memory Packages And Pinout Designs
App 20170162546 - Fai; Anthony ; et al. | 2017-06-08 |
Systems and methods for high-speed, low-profile memory packages and pinout designs
Grant 9,583,452 - Fai , et al. February 28, 2 | 2017-02-28 |
Systems And Methods For High-speed, Low-profile Memory Packages And Pinout Designs
App 20170005056 - Fai; Anthony ; et al. | 2017-01-05 |
Systems and methods for high-speed, low-profile memory packages and pinout designs
Grant 9,466,571 - Fai , et al. October 11, 2 | 2016-10-11 |
Hybrid Simulation Methodologies
App 20160283621 - Yang; Zhiping ; et al. | 2016-09-29 |
Methods And Apparatus For Equalization Of A High Speed Serial Bus
App 20160267044 - WU; Songping ; et al. | 2016-09-15 |
Semiconductor package including an embedded circuit component within a support structure of the package
Grant 9,414,497 - Savic , et al. August 9, 2 | 2016-08-09 |
Manufacturing a Semiconductor Package Including an Embedded Circuit Component within a Support Structure of the Package
App 20150342053 - Savic; Jovica ; et al. | 2015-11-26 |
Systems And Methods For High-speed, Low-profile Memory Packages And Pinout Designs
App 20150325560 - Fai; Anthony ; et al. | 2015-11-12 |
Manufacturing a semiconductor package including an embedded circuit component within a support structure of the package
Grant 9,129,908 - Savic , et al. September 8, 2 | 2015-09-08 |
Ear Warmer Frame
App 20150216731 - Bouza; Kevin ; et al. | 2015-08-06 |
Systems and methods for high-speed, low-profile memory packages and pinout designs
Grant 9,087,846 - Fai , et al. July 21, 2 | 2015-07-21 |
Capacitive Sensing Array Having Electrical Isolation
App 20150070079 - Yang; Zhiping ; et al. | 2015-03-12 |
Unified Pcb Design For Ssd Applications, Various Density Configurations, And Direct Nand Access
App 20140264904 - Fai; Anthony ; et al. | 2014-09-18 |
Systems And Methods For High-speed, Low-profile Memory Packages And Pinout Designs
App 20140264906 - Fai; Anthony ; et al. | 2014-09-18 |
Optical module design in an SFP form factor to support increased rates of data transmission
Grant 8,727,793 - Cafiero , et al. May 20, 2 | 2014-05-20 |
Manufacturing A Semiconductor Package Including An Embedded Circuit Component Within A Support Structure Of The Package
App 20130122658 - Savic; Jovica ; et al. | 2013-05-16 |
Semiconductor Package Including An External Circuit Element
App 20130015557 - Yang; Zhiping ; et al. | 2013-01-17 |
Optical Module Design in an SFP Form Factor to Support Increased Rates of Data Transmission
App 20120230700 - Cafiero; Luca ; et al. | 2012-09-13 |
Hybrid Simulation Methodologies To Simulate Risk Factors
App 20110167020 - Yang; Zhiping ; et al. | 2011-07-07 |
Computer-Implemented Systems And Methods For Dynamic Model Switching Simulation Of Risk Factors
App 20110153536 - Yang; Zhiping ; et al. | 2011-06-23 |
Techniques for simulating a decision feedback equalizer circuit
Grant 7,924,911 - Yang April 12, 2 | 2011-04-12 |
Methods and apparatus for providing a power signal to an area array package
Grant 7,675,147 - Hubbard , et al. March 9, 2 | 2010-03-09 |
DDR interface for reducing SSO/SSI noise
Grant 7,486,702 - Yang February 3, 2 | 2009-02-03 |
Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors
Grant 7,360,307 - Yang , et al. April 22, 2 | 2008-04-22 |
Methods and apparatus for providing a power signal to an area array package
Grant 7,303,941 - Hubbard , et al. December 4, 2 | 2007-12-04 |
Techniques for alleviating the need for DC blocking capacitors in high-speed differential signal pairs
Grant 7,262,974 - Yang , et al. August 28, 2 | 2007-08-28 |
Techniques for providing EMI shielding within a circuit board component
Grant 7,254,032 - Xue , et al. August 7, 2 | 2007-08-07 |
Techniques for alleviating the need for DC blocking capacitors in high-speed differential signal pairs
App 20070097658 - Yang; Zhiping ; et al. | 2007-05-03 |
Techniques for simulating a decision feedback equalizer circuit
App 20070091993 - Yang; Zhiping | 2007-04-26 |
Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors
App 20060073641 - Yang; Zhiping ; et al. | 2006-04-06 |
Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors
Grant 6,992,374 - Yang , et al. January 31, 2 | 2006-01-31 |
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