Yang; Xuyi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Xuyi.The latest application filed is for "wire bond pad design for compact stacked-die package".

Company Profile

3.7.8

Yang; Xuyi - Shanghai CN
Yang; Xuyi - Shanghai City CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated electronic element module, semiconductor package, and method for fabricating the same Grant 11,456,279 - Zhang , et al. September 27, 2	2022-09-27
Side contact pads for high-speed memory card Grant 11,425,817 - Ma , et al. August 23, 2	2022-08-23
Semiconductor device including vertically stacked semiconductor dies Grant 11,302,673 - Yang , et al. April 12, 2	2022-04-12
High capacity semiconductor device including bifurcated memory module Grant 11,276,669 - Yang , et al. March 15, 2	2022-03-15
Multi-module integrated interposer and semiconductor device formed therefrom Grant 11,257,785 - Zhang , et al. February 22, 2	2022-02-22
Wire Bond Pad Design For Compact Stacked-die Package App 20220052002 - Yang; Xuyi ; et al.	2022-02-17
Side Contact Pads For High-speed Memory Card App 20210400811 - MA; SHINENG ; et al.	2021-12-23
Wire bond pad design for compact stacked-die package Grant 11,189,582 - Yang , et al. November 30, 2	2021-11-30
Semiconductor device including contact fingers on opposed surfaces Grant 11,139,277 - Chen , et al. October 5, 2	2021-10-05
Wire Bond Pad Design For Compact Stacked-die Package App 20210151399 - Yang; Xuyi ; et al.	2021-05-20
Integrated Electronic Element Module, Semiconductor Package, And Method For Fabricating The Same App 20210043602 - Zhang; Cong ; et al.	2021-02-11
Semiconductor Device Including Contact Fingers On Opposed Surfaces App 20200411478 - Chen; Chien Te ; et al.	2020-12-31
Semiconductor Device Including Vertically Stacked Semiconductor Dies App 20200411481 - Yang; Xuyi ; et al.	2020-12-31
High Capacity Semiconductor Device Including Bifurcated Memory Module App 20200411480 - Yang; Xuyi ; et al.	2020-12-31
Multi-module Integrated Interposer And Semiconductor Device Formed Therefrom App 20200365554 - Zhang; Cong ; et al.	2020-11-19

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