Yang; Tzong-Hann
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yang; Tzong-Hann.The latest application filed is for "bonding package components through plating".
- Yang; Tzong-Hann - Taipei TW
- Yang; Tzong-Hann - Taipei City TW
| Patent | Date |
|---|---|
| Bonding package components through plating Grant 10,840,212 - Lim , et al. November 17, 2 | 2020-11-17 |
| Bonding Package Components Through Plating App 20200020662 - Lim; Zheng-Yi ; et al. | 2020-01-16 |
| Bonding package components through plating Grant 10,483,230 - Lim , et al. Nov | 2019-11-19 |
| Bonding Package Components Through Plating App 20170294402 - Lim; Zheng-Yi ; et al. | 2017-10-12 |
| Bonding package components through plating Grant 9,691,738 - Lim , et al. June 27, 2 | 2017-06-27 |
| Adjusting sizes of connectors of package components Grant 9,430,605 - Lai , et al. August 30, 2 | 2016-08-30 |
| Bonding Package Components Through Plating App 20150364449 - Lim; Zheng-Yi ; et al. | 2015-12-17 |
| Adjusting Sizes of Connectors of Package Components App 20150347663 - Lai; Chih-Wei ; et al. | 2015-12-03 |
| Bonding package components through plating Grant 9,117,772 - Lim , et al. August 25, 2 | 2015-08-25 |
| Adjusting sizes of connectors of package components Grant 9,111,064 - Lai , et al. August 18, 2 | 2015-08-18 |
| Adjusting Sizes of Connectors of Package Components App 20140308764 - Lai; Chih-Wei ; et al. | 2014-10-16 |
| Adjusting sizes of connectors of package components Grant 8,791,579 - Lai , et al. July 29, 2 | 2014-07-29 |
| Bonding Package components Through Plating App 20130334692 - Lim; Zheng-Yi ; et al. | 2013-12-19 |
| Metal bump formation Grant 8,501,615 - Cheng , et al. August 6, 2 | 2013-08-06 |
| Adjusting Sizes of Connectors of Package Components App 20130127059 - Lai; Chih-Wei ; et al. | 2013-05-23 |
| Metal Bump Formation App 20120322255 - Cheng; Ming-Da ; et al. | 2012-12-20 |
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