loadpatents
name:-0.0080142021179199
name:-0.0070619583129883
name:-0.0016329288482666
Yang; Sung Uk Patent Filings

Yang; Sung Uk

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Sung Uk.The latest application filed is for "process for producing fluorinated compounds using alcohol solvent having carbonyl group".

Company Profile
1.6.8
  • Yang; Sung Uk - Seoul KR
  • Yang; Sung Uk - Singapore N/A SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Process For Producing Fluorinated Compounds Using Alcohol Solvent Having Carbonyl Group
App 20190202820 - Chi; Dae Yoon ;   et al.
2019-07-04
Integrated circuit package system with encapsulation lock
Grant 8,779,568 - Do , et al. July 15, 2
2014-07-15
Integrated Circuit Package System With Encapsulation Lock
App 20120104579 - Do; Byung Tai ;   et al.
2012-05-03
Integrated circuit package system with encapsulation lock
Grant 8,093,693 - Do , et al. January 10, 2
2012-01-10
Integrated circuit package system with encapsulation lock
Grant 8,067,271 - Do , et al. November 29, 2
2011-11-29
Integrated circuit package system with encapsulation lock and method of manufacture thereof
Grant 7,919,838 - Do , et al. April 5, 2
2011-04-05
Integrated Circuit Package System With Encapsulation Lock And Method Of Manufacture Thereof
App 20100117205 - Do; Byung Tai ;   et al.
2010-05-13
Waferscale package system
Grant 7,414,310 - Do , et al. August 19, 2
2008-08-19
Integrated Circuit Package System With Encapsulation Lock
App 20080067640 - Do; Byung Tai ;   et al.
2008-03-20
Integrated Circuit Package System With Encapsulation Lock
App 20080067698 - Do; Byung Tai ;   et al.
2008-03-20
Integrated Circuit Package System With Encapsulation Lock
App 20080067639 - Do; Byung Tai ;   et al.
2008-03-20
Waferscale Package System
App 20070176280 - Do; Byung Tai ;   et al.
2007-08-02
Integrated Circuit System With Waferscale Spacer System
App 20070178666 - Do; Byung Tai ;   et al.
2007-08-02

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