Yang; Su-Chun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Su-Chun.The latest application filed is for "bonding with pre-deoxide process and apparatus for performing the same".

Company Profile

3.12.18

Yang; Su-Chun - Hsinchu County TW
Yang; Su-Chun - Hsinchu TW
Yang; Su-Chun - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device Grant 11,456,256 - Tung , et al. September 27, 2	2022-09-27
Bonding method of package components and bonding apparatus Grant 11,443,981 - Hsiao , et al. September 13, 2	2022-09-13
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same App 20220285310 - Yu; Chen-Hua ; et al.	2022-09-08
Bonding with pre-deoxide process and apparatus for performing the same Grant 11,342,302 - Yu , et al. May 24, 2	2022-05-24
Package Structure App 20210375724 - SHAO; Tung-Liang ; et al.	2021-12-02
Semiconductr Device, Stacked Semiconductor Device And Manufacturing Method Of Semiconductor Device App 20210375766 - Tung; Chih-Hang ; et al.	2021-12-02
Chip Package Structure With Redistribution Layer Having Bonding Portion App 20210335750 - TUNG; Chih-Hang ; et al.	2021-10-28
Package structure and method for forming the same Grant 11,101,195 - Shao , et al. August 24, 2	2021-08-24
Chip package structure and method for forming the same Grant 11,056,459 - Tung , et al. July 6, 2	2021-07-06
Bonding Method Of Package Components And Bonding Apparatus App 20210050251 - Hsiao; Yi-Li ; et al.	2021-02-18
Package Structure And Method For Forming The Same App 20200091039 - SHAO; Tung-Liang ; et al.	2020-03-19
Chip Package Structure And Method For Forming The Same App 20200058614 - TUNG; Chih-Hang ; et al.	2020-02-20
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same App 20190326251 - Yu; Chen-Hua ; et al.	2019-10-24
Solder bump stretching method Grant 10,163,835 - Yang , et al. Dec	2018-12-25
Metal post bonding using pre-fabricated metal posts Grant 10,034,390 - Hsiao , et al. July 24, 2	2018-07-24
Solder bump stretching method for forming a solder bump joint in a device Grant 9,978,709 - Yang , et al. May 22, 2	2018-05-22
Solder Bump Stretching Method App 20180108632 - YANG; Su-Chun ; et al.	2018-04-19
Thinning process using metal-assisted chemical etching Grant 9,893,046 - Yang , et al. February 13, 2	2018-02-13
Thinning Process Using Metal-assisted Chemical Etching App 20180012880 - YANG; Su-Chun ; et al.	2018-01-11
Solder bump stretching method and device for performing the same Grant 9,842,817 - Yang , et al. December 12, 2	2017-12-12
System and Method for Immersion Bonding App 20170330855 - Tung; Chih-Hang ; et al.	2017-11-16
Solder Bump Stretching Method For Forming A Solder Bump Joint In A Device App 20170012019 - YANG; Su-Chun ; et al.	2017-01-12
Solder bump joint in a device including lamellar structures Grant 9,475,145 - Yang , et al. October 25, 2	2016-10-25
Metal Post Bonding Using Pre-Fabricated Metal Posts App 20160143157 - Hsiao; Yi-Li ; et al.	2016-05-19
Method for manufacturing a plurality of metal posts Grant 9,263,407 - Hsiao , et al. February 16, 2	2016-02-16
Solder Bump Stretching Method And Device For Performing The Same App 20150079763 - YANG; Su-Chun ; et al.	2015-03-19
Metal Post Bonding Using Pre-Fabricated Metal Posts App 20140262470 - Hsiao; Yi-Li ; et al.	2014-09-18
Solder Bump Stretching Method For Forming A Solder Bump Joint In A Device App 20130221521 - Yang; Su-Chun ; et al.	2013-08-29
Solder Bump Stretching Method App 20130221074 - WEI; Cheng-Chang ; et al.	2013-08-29

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