Yang; Song-Fu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yang; Song-Fu.The latest application filed is for "packaging substrate and manufacturing method thereof".
- Yang; Song-Fu - Kaohsiung TW
| Patent | Date |
|---|---|
| Wire-bonding method for wire-bonding apparatus Grant 7,581,666 - Tong , et al. September 1, 2 | 2009-09-01 |
| Two-stage die-bonding method for simultaneous die-bonding of multiple dies Grant 7,547,575 - Tong , et al. June 16, 2 | 2009-06-16 |
| Packaging substrate and manufacturing method thereof Grant 7,445,944 - Tong , et al. November 4, 2 | 2008-11-04 |
| Packaging substrate and manufacturing method thereof App 20080124836 - Tong; Ho-Ming ; et al. | 2008-05-29 |
| Wire-bonding method for wire-bonding apparatus App 20080102539 - Tong; Ho-Ming ; et al. | 2008-05-01 |
| Die Bonder And Die Bonding Method Thereof App 20080085571 - Tong; Ho-Ming ; et al. | 2008-04-10 |
| Packaging substrate and method of manufacturing the same App 20080044931 - Tong; Ho-Ming ; et al. | 2008-02-21 |
| Wire-bonding apparatus and wire-bonding method thereof App 20080035706 - Tong; Ho-Ming ; et al. | 2008-02-14 |
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