Yang; Shu-Jung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yang; Shu-Jung.The latest application filed is for "ear tag module".
- Yang; Shu-Jung - Tainan City TW
- Yang; Shu-Jung - Hsinchu TW
- Yang; Shu-Jung - Tainan TW
- Yang; Shu-Jung - Tainan County TW
- Yang; Shu-Jung - Guiren Township Tainan County TW
- Yang; Shu Jung - Hsinchu County TW
| Patent | Date |
|---|---|
| Ear Tag Module App 20200383298 - Yang; Shu-Jung ; et al. | 2020-12-10 |
| Plug-in type power module and subsystem thereof Grant 10,818,574 - Yang , et al. October 27, 2 | 2020-10-27 |
| Plug-in Type Power Module And Subsystem Thereof App 20200286808 - Yang; Shu-Jung ; et al. | 2020-09-10 |
| Plug-in type power module and subsystem thereof Grant 10,707,143 - Yang , et al. | 2020-07-07 |
| Power module and manufacturing method thereof Grant 10,051,742 - Yang , et al. August 14, 2 | 2018-08-14 |
| Plug-in Type Power Module And Subsystem Thereof App 20170345735 - Yang; Shu-Jung ; et al. | 2017-11-30 |
| Power Module And Manufacturing Method Thereof App 20170171978 - Yang; Shu-Jung ; et al. | 2017-06-15 |
| Power module Grant 9,418,921 - Yang , et al. August 16, 2 | 2016-08-16 |
| Power Module App 20160172285 - Yang; Shu-Jung ; et al. | 2016-06-16 |
| Power module Grant 9,240,370 - Yang , et al. January 19, 2 | 2016-01-19 |
| Heat Exchanger And Semiconductor Module App 20140138075 - Yang; Shu-Jung ; et al. | 2014-05-22 |
| Light emitting devices having heat-dissipating surface Grant 8,408,747 - Wang , et al. April 2, 2 | 2013-04-02 |
| Heat-pipe electric-power generating device Grant 8,283,613 - Tain , et al. October 9, 2 | 2012-10-09 |
| Chip package structure and manufacturing method thereof Grant 8,004,079 - Tain , et al. August 23, 2 | 2011-08-23 |
| Light Emitting Devices Having Heat-dissipating Surface App 20100085754 - Wang; Kung-Hsia ; et al. | 2010-04-08 |
| Composite mode transducer and cooling device having the composite mode transducer Grant 7,683,522 - Cheng , et al. March 23, 2 | 2010-03-23 |
| Chip Package Structure And Manufacturing Method Thereof App 20090294947 - Tain; Ra-Min ; et al. | 2009-12-03 |
| Ultrasonic atomizing cooling apparatus Grant 7,610,769 - Tain , et al. November 3, 2 | 2009-11-03 |
| Light emitting diode lighting module with improved heat dissipation structure Grant 7,586,126 - Yang , et al. September 8, 2 | 2009-09-08 |
| Composite mode transducer and cooling device having the composite mode transducer Grant 7,567,015 - Cheng , et al. July 28, 2 | 2009-07-28 |
| Composite mode transducer and cooling device having the composite mode transducer App 20080135213 - Cheng; Syh-Yuh ; et al. | 2008-06-12 |
| Light Emitting Diode Lighting Module with Improved Heat Dissipation Structure App 20080023720 - Yang; Shu Jung ; et al. | 2008-01-31 |
| Composite mode transducer and cooling device having the composite mode transducer App 20070205690 - Cheng; Syh-Yuh ; et al. | 2007-09-06 |
| Closed-loop latent heat cooling method and capillary force or non-nozzle module thereof App 20070163756 - Wang; Chih-Yao ; et al. | 2007-07-19 |
| Heat-pipe Electric-power Generating Device App 20070151969 - Tain; Ra-Min ; et al. | 2007-07-05 |
| Ultrasonic atomizing cooling apparatus App 20060130506 - Tain; Ra-Min ; et al. | 2006-06-22 |
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