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name:-0.014113187789917
name:-0.012026071548462
Yang; Sheng-Pin Patent Filings

Yang; Sheng-Pin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Sheng-Pin.The latest application filed is for "hybrid micro-bump integration with redistribution layer".

Company Profile
9.8.10
  • Yang; Sheng-Pin - Kaohsiung TW
  • YANG; Sheng-Pin - Kaohsiung City TW
  • Yang; Sheng Pin - Chengdu CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Hybrid Micro-bump Integration With Redistribution Layer
App 20220230978 - Yang; Ting-Li ;   et al.
2022-07-21
Method of manufacturing semiconductor structure
Grant 11,069,652 - Kalnitsky , et al. July 20, 2
2021-07-20
Semiconductor Device Structure With Protection Cap
App 20200381293 - YANG; Ting-Li ;   et al.
2020-12-03
Method of manufacturing an integrated inductor with protections caps on conductive lines
Grant 10,748,810 - Yang , et al. A
2020-08-18
Method Of Manufacturing Semiconductor Structure
App 20200152599 - KALNITSKY; ALEXANDER ;   et al.
2020-05-14
Etching and mechanical grinding film-layers stacked on a semiconductor substrate
Grant 10,566,204 - Kong , et al. Feb
2020-02-18
Method of manufacturing semiconductor structure
Grant 10,535,629 - Kalnitsky , et al. Ja
2020-01-14
Semiconductor Device Structure With Protection Cap And Method For Forming The Same
App 20190371653 - YANG; Ting-Li ;   et al.
2019-12-05
Etching And Mechanical Grinding Film-layers Stacked On A Semiconductor Substrate
App 20190214263 - KONG; Jian Jun ;   et al.
2019-07-11
Semiconductor device and method of forming the same
Grant 10,269,703 - Ku , et al.
2019-04-23
Method Of Manufacturing Semiconductor Structure
App 20190115313 - KALNITSKY; ALEXANDER ;   et al.
2019-04-18
Etching and mechanical grinding film-layers stacked on a semiconductor substrate
Grant 10,249,504 - Kong , et al.
2019-04-02
Etching And Mechanical Grinding Film-layers Stacked On A Semiconductor Substrate
App 20190067017 - Kong; Jian Jun ;   et al.
2019-02-28
Method of manufacturing semiconductor structure
Grant 10,163,849 - Kalnitsky , et al. Dec
2018-12-25
Semiconductor Device And Method Of Forming The Same
App 20180151493 - KU; CHIN-YU ;   et al.
2018-05-31
Method Of Manufacturing Semiconductor Structure
App 20180047701 - KALNITSKY; ALEXANDER ;   et al.
2018-02-15
Semiconductor structure and manufacturing method thereof
Grant 9,799,625 - Kalnitsky , et al. October 24, 2
2017-10-24
Semiconductor Structure And Manufacturing Method Thereof
App 20160365332 - KALNITSKY; ALEXANDER ;   et al.
2016-12-15

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