loadpatents
Patent applications and USPTO patent grants for Yang; Ronggui.The latest application filed is for "single and multi-layer mesh structures for enhanced thermal transport".
Patent | Date |
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Single And Multi-layer Mesh Structures For Enhanced Thermal Transport App 20220221233 - Yang; Ronggui ;   et al. | 2022-07-14 |
Optically-switchable thermally-insulating VO.sub.2-aerogel hybrid film for window retrofits Grant 11,359,434 - Yang June 14, 2 | 2022-06-14 |
Thermal ground plane Grant 11,353,269 - Yang , et al. June 7, 2 | 2022-06-07 |
Thermal Management Planes App 20220163268 - Lewis; Ryan J. ;   et al. | 2022-05-26 |
Single and multi-layer mesh structures for enhanced thermal transport Grant 11,306,983 - Yang , et al. April 19, 2 | 2022-04-19 |
Durability-enhanced Thermochromic Film And Method Of Manufacturing Same App 20220089835 - Yang; Ronggui | 2022-03-24 |
Optically-switchable Thermally-insulating Vo2-aerogel Hybrid Film For Window Retrofits App 20220090443 - Yang; Ronggui | 2022-03-24 |
Thermal Management Planes App 20220074673 - Lewis; Ryan J. ;   et al. | 2022-03-10 |
Single And Multi-layer Mesh Structures For Enhanced Thermal Transport App 20210131753 - Yang; Ronggui ;   et al. | 2021-05-06 |
Radiative Cooling Structures and Systems App 20210010764 - YANG; Ronggui ;   et al. | 2021-01-14 |
Micropillar-enabled Thermal Ground Plane App 20200300563 - Lewis; Ryan John ;   et al. | 2020-09-24 |
Micropillar-enabled thermal ground plane Grant 10,731,925 - Lewis , et al. | 2020-08-04 |
Method and device for spreading high heat fluxes in thermal ground planes Grant 10,724,804 - Lewis , et al. | 2020-07-28 |
Radiative cooling structures and systems Grant 10,724,809 - Yang , et al. | 2020-07-28 |
Thermal Ground Plane App 20200191495 - Yang; Ronggui ;   et al. | 2020-06-18 |
Thermal ground plane Grant 10,571,200 - Yang , et al. Feb | 2020-02-25 |
Thermal ground plane Grant 10,527,358 - Yang , et al. J | 2020-01-07 |
Radiative cooling structures and systems Grant 10,502,505 - Yang , et al. Dec | 2019-12-10 |
Radiative Cooling Structures And Systems App 20190086164 - YANG; Ronggui ;   et al. | 2019-03-21 |
Thermal Management Planes App 20180320984 - Lewis; Ryan J. ;   et al. | 2018-11-08 |
Method And Device For Spreading High Heat Fluxes In Thermal Ground Planes App 20180128553 - Lewis; Ryan John ;   et al. | 2018-05-10 |
Method And Device For Optimization Of Vapor Transport In A Thermal Ground Plane Using Void Space In Mobile Systems App 20180106554 - LEWIS; RYAN JOHN ;   et al. | 2018-04-19 |
Flexible thermal ground plane and manufacturing the same Grant 9,909,814 - Yang , et al. March 6, 2 | 2018-03-06 |
Thermal Ground Plane App 20170299277 - Yang; Ronggui ;   et al. | 2017-10-19 |
Radiative Cooling Structures And Systems App 20170248381 - YANG; Ronggui ;   et al. | 2017-08-31 |
Flexible thermal ground plane and manufacturing the same Grant 9,651,312 - Yang , et al. May 16, 2 | 2017-05-16 |
Thermal Ground Plane App 20170030654 - Yang; Ronggui ;   et al. | 2017-02-02 |
Multistage thick film thermoelectric devices Grant 9,391,255 - Chen , et al. July 12, 2 | 2016-07-12 |
Flexible Thermal Ground Plane And Manufacturing The Same App 20160187070 - Yang; Ronggui ;   et al. | 2016-06-30 |
Vacuum-enhanced Heat Spreader App 20160081227 - Lee; Yung-Cheng ;   et al. | 2016-03-17 |
Micropillar-enabled Thermal Ground Plane App 20160076820 - Lewis; Ryan John ;   et al. | 2016-03-17 |
Flexible thermal ground plane and manufacturing the same Grant 9,163,883 - Yang , et al. October 20, 2 | 2015-10-20 |
Flexible Thermal Ground Plane And Manufacturing The Same App 20150226493 - Yang; Ronggui ;   et al. | 2015-08-13 |
Flexible Thermal Ground Plane And Manufacturing The Same App 20110017431 - Yang; Ronggui ;   et al. | 2011-01-27 |
Surface plasmon coupled nonequilibrium thermoelectric devices Grant 7,508,110 - Chen , et al. March 24, 2 | 2009-03-24 |
Multistage Thick Film Thermoelectric Devices App 20080178606 - Chen; Gang ;   et al. | 2008-07-31 |
Surface plasmon coupled nonequilibrium thermoelectric devices App 20050247337 - Chen, Gang ;   et al. | 2005-11-10 |
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