Yang; Ming-Kun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yang; Ming-Kun.The latest application filed is for "interposer and method for forming the same".
- Yang; Ming-Kun - Pingzhen N/A TW
- YANG; Ming-Kun - Pingzhen City TW
- Yang; Ming-Kun - Taoyuan County TW
| Patent | Date |
|---|---|
| Method for forming chip package Grant 9,711,403 - Chen , et al. July 18, 2 | 2017-07-18 |
| Chip package and method for forming the same Grant 9,559,001 - Yen , et al. January 31, 2 | 2017-01-31 |
| Interposer and method for forming the same Grant 8,692,300 - Yang , et al. April 8, 2 | 2014-04-08 |
| Interposer And Method For Forming The Same App 20120193811 - YANG; Ming-Kun ; et al. | 2012-08-02 |
| Method For Forming Chip Package App 20120184070 - CHEN; Chien-Hui ; et al. | 2012-07-19 |
| Chip Package And Method For Forming The Same App 20120104445 - YANG; Ming-Kun ; et al. | 2012-05-03 |
| Chip Package And Method For Forming The Same App 20120080706 - YANG; Ming-Kun ; et al. | 2012-04-05 |
| Chip Submount, Chip Package, And Fabrication Method Thereof App 20110291153 - Yang; Ming-Kun ; et al. | 2011-12-01 |
| Chip Package And Method For Forming The Same App 20110193241 - YEN; Yu-Lin ; et al. | 2011-08-11 |
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