YANG; Kun-Ho
Patent Applications and Registrations
Patent applications and USPTO patent grants for YANG; Kun-Ho.The latest application filed is for "latex composition for dip molding and dip-molded article including the same".
- YANG; Kun-Ho - Daejeon KR
- Yang; Kun Ho - Gyeonggi-do KR
- Yang; Kun Ho - Taipei TW
- Yang; Kun Ho - Ulsun KR
| Patent | Date |
|---|---|
| Latex Composition For Dip Molding And Dip-molded Article Including The Same App 20210253768 - CHOUNG; Sung Hun ; et al. | 2021-08-19 |
| Method For Bending The Self-regulating Cable And Heating Mat For Protecting Over-heating App 20110060390 - Kim; Seo Gon ; et al. | 2011-03-10 |
| Portable wireless communication apparatus Grant 7,548,209 - Cheng , et al. June 16, 2 | 2009-06-16 |
| Portable wireless communication apparatus App 20090073057 - Cheng; Chia Hua ; et al. | 2009-03-19 |
| Polymerization method for carboxylated styrene-butadiene latex using tertiary-dodecyl mercaptan as chain transfer agent Grant 5,948,870 - Jang , et al. September 7, 1 | 1999-09-07 |
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