Yang; Ke-Chuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Ke-Chuan.The latest application filed is for "circuit board structure and method for fabricating the same".

Company Profile

0.10.9

Yang; Ke-Chuan - Taichung Hsien TW
Yang; Ke Chuan - Taichung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit board structure and method for fabricating the same Grant 7,999,189 - Chen , et al. August 16, 2	2011-08-16
Heat-dissipating structure and heat-dissipating semiconductor package having the same Grant 7,863,731 - Chen , et al. January 4, 2	2011-01-04
Circuit board structure and method for fabricating the same App 20090020323 - Chen; Chien-Te ; et al.	2009-01-22
Heat dissipation semiconductor pakage App 20080157344 - Chen; Chin-Te ; et al.	2008-07-03
Heat-dissipating structure and heat-dissipating semiconductor package having the same App 20080142955 - Chen; Chin-Te ; et al.	2008-06-19
Multi-chip stack structure App 20070054439 - Yang; Ke Chuan	2007-03-08
Flip-chip semiconductor package with lead frame and method for fabricating the same Grant 7,170,168 - Wu , et al. January 30, 2	2007-01-30
Photosensitive semiconductor package and method for fabricating the same Grant 7,084,474 - Hung , et al. August 1, 2	2006-08-01
Semiconductor device with under bump metallurgy and method for fabricating the same Grant 7,056,818 - Yang June 6, 2	2006-06-06
Flip-chip semiconductor package with lead frame and method for fabricating the same App 20060017173 - Wu; Chi-Chuan ; et al.	2006-01-26
Photosensitive semiconductor package and method for fabricating the same App 20050139946 - Hung, Chia-Yu ; et al.	2005-06-30
Semiconductor device with under bump metallurgy and method for fabricating the same App 20050001313 - Yang, Ke-Chuan	2005-01-06
Fabrication method of strengthening flip-chip solder bumps Grant 6,821,876 - Yang November 23, 2	2004-11-23
Semiconductor device with under bump metallurgy and method for fabricating the same Grant 6,787,903 - Yang September 7, 2	2004-09-07
Non-leaded semiconductor package and method of fabricating the same Grant 6,774,499 - Yang August 10, 2	2004-08-10
Semiconductor device with under bump metallurgy and method for fabricating the same App 20040092092 - Yang, Ke-Chuan	2004-05-13
Fabrication method for strengthening flip-chip solder bumps App 20040048458 - Yang, Ke-Chuan	2004-03-11
Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer Grant 6,692,629 - Chen , et al. February 17, 2	2004-02-17
Method of fabricating solder bumps with high coplanarity for flip-chip application Grant 6,348,401 - Chen , et al. February 19, 2	2002-02-19

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