Yang; Kai-Shing

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Kai-Shing.The latest application filed is for "three-dimensional pulsating heat pipe, three-dimensional pulsating heat pipe assembly and heat dissipation module".

Company Profile

2.3.9

Yang; Kai-Shing - Zhubei TW
YANG; Kai-Shing - Zhubei City TW
Yang; Kai-Shing - Changhua County TW
Yang; Kai-Shing - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Three-dimensional pulsating heat pipe, three-dimensional pulsating heat pipe assembly and heat dissipation module Grant 10,782,079 - Tseng , et al. Sept	2020-09-22
Three-dimensional Pulsating Heat Pipe, Three-dimensional Pulsating Heat Pipe Assembly And Heat Dissipation Module App 20200088479 - TSENG; Chih-Yung ; et al.	2020-03-19
Multi-pipe Three-dimensional Plusating Heat Pipe App 20180010860 - TSENG; CHIH-YUNG ; et al.	2018-01-11
Composite Fiber Capillary Structure, Heat Pipe Thereof And Fabricating Method For The Same App 20170153067 - LO; WEI-CHUN ; et al.	2017-06-01
Heat Distribution Structure, Manufacturing Method For The Same And Heat-dissipation Module Incorporating The Same App 20130133864 - Yang; Kai-Shing ; et al.	2013-05-30
Heat-dissipating Device And Heat-dissipating System App 20130112377 - Yang; Kai-Shing ; et al.	2013-05-09
Cold plate and refrigeration system Grant 8,312,736 - Yang , et al. November 20, 2	2012-11-20
Two-stage expansion cooling system and evaporator thereof Grant 8,191,385 - Wei , et al. June 5, 2	2012-06-05
Cold Plate And Refrigeration System App 20100126209 - Yang; Kai-Shing ; et al.	2010-05-27
Two-stage Expansion Cooling System And Evaporator Thereof App 20100071405 - Wei; Chung-Szu ; et al.	2010-03-25

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