| Patent | Date |
|---|
Semiconductor device and method of controlling warpage in semiconductor package
Grant 9,406,579 - Choi , et al. August 2, 2 | 2016-08-02 |
Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfaces
Grant 9,401,289 - Kim , et al. July 26, 2 | 2016-07-26 |
Semiconductor device and method of depositing underfill material with uniform flow rate
Grant 9,390,945 - Lee , et al. July 12, 2 | 2016-07-12 |
Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die
Grant 9,281,228 - Choi , et al. March 8, 2 | 2016-03-08 |
Stackable package by using internal stacking modules
Grant 9,245,772 - Yang , et al. January 26, 2 | 2016-01-26 |
Integrated circuit packaging system with heatsink cap and method of manufacture thereof
Grant 9,142,481 - Kim , et al. September 22, 2 | 2015-09-22 |
Stackable Package by Using Internal Stacking Modules
App 20140319702 - Yang; JoungIn ; et al. | 2014-10-30 |
Integrated circuit packaging system with heat slug and method of manufacture thereof
Grant 8,710,640 - Choi , et al. April 29, 2 | 2014-04-29 |
Integrated Circuit Packaging System With Warpage Prevention Mechanism And Method Of Manufacture Thereof
App 20130334714 - Park; YiSu ; et al. | 2013-12-19 |
Integrated Circuit Packaging System With Film Assist And Method Of Manufacture Thereof
App 20130328220 - Lee; KyungHoon ; et al. | 2013-12-12 |
Semiconductor Device and Method of Backgrinding and Singulation of Semiconductor Wafer while Reducing Kerf Shifting and Protecting Wafer Surfaces
App 20130320519 - Kim; MinJung ; et al. | 2013-12-05 |
Integrated Circuit Packaging System With Heatsink Cap And Method Of Manufacture Thereof
App 20130322023 - Kim; Gwangjin ; et al. | 2013-12-05 |
Package-on-package system with through vias and method of manufacture thereof
Grant 8,598,034 - Park , et al. December 3, 2 | 2013-12-03 |
Semiconductor Device and Method of Controlling Warpage in Semiconductor Package
App 20130300004 - Choi; DaeSik ; et al. | 2013-11-14 |
Semiconductor Device and Method of Depositing Underfill Material With Uniform Flow Rate
App 20130299995 - Lee; KyungHoon ; et al. | 2013-11-14 |
Integrated circuit packaging system with embedded interconnect and method of manufacture thereof
Grant 8,476,775 - Yang , et al. July 2, 2 | 2013-07-02 |
Integrated Circuit Packaging System With Heat Slug And Method Of Manufacture Thereof
App 20130154078 - Choi; DaeSik ; et al. | 2013-06-20 |
Semiconductor Device and Method of Forming Sloped Surface in Patterning Layer to Separate Bumps of Semiconductor Die from Patterning Layer
App 20130113118 - Kim; MinJung ; et al. | 2013-05-09 |
Semiconductor Device and Method of Forming Thermal Interface Material and Heat Spreader Over Semiconductor Die
App 20130105963 - Choi; DaeSik ; et al. | 2013-05-02 |
Package-on-package System With Through Vias And Method Of Manufacture Thereof
App 20130075933 - Park; DongSam ; et al. | 2013-03-28 |
Package-on-package System With Through Vias And Method Of Manufacture Thereof
App 20110254172 - Park; DongSam ; et al. | 2011-10-20 |
Integrated circuit package system with interposer
Grant 8,035,210 - Yang , et al. October 11, 2 | 2011-10-11 |
Package-on-package system with through vias and method of manufacture thereof
Grant 7,986,048 - Park , et al. July 26, 2 | 2011-07-26 |
Integrated Circuit Packaging System With Embedded Interconnect And Method Of Manufacture Thereof
App 20110147906 - Yang; JoungIn ; et al. | 2011-06-23 |
Package-on-package system with internal stacking module interposer
Grant 7,901,987 - Yang , et al. March 8, 2 | 2011-03-08 |
Stackable Package By Using Internal Stacking Modules
App 20110024890 - Yang; JoungIn ; et al. | 2011-02-03 |
Integrated circuit package system with stacking module
Grant 7,804,166 - Yang , et al. September 28, 2 | 2010-09-28 |
Integrated Circuit Packaging System With Layered Packaging And Method Of Manufacture Thereof
App 20100237482 - Yang; JoungIn ; et al. | 2010-09-23 |
Stackable package by using internal stacking modules
Grant 7,800,211 - Yang , et al. September 21, 2 | 2010-09-21 |
Package-on-package System With Through Vias And Method Of Manufacture Thereof
App 20100207262 - Park; DongSam ; et al. | 2010-08-19 |
Integrated Circuit Package System With Stacking Module
App 20090236754 - Yang; Joungin ; et al. | 2009-09-24 |
Package-on-package System With Internal Stacking Module Interposer
App 20090236718 - Yang; Joungin ; et al. | 2009-09-24 |
Integrated Circuit Package System With Interposer
App 20090166835 - Yang; Joungin ; et al. | 2009-07-02 |
Stacked integrated circuit package-in-package system
Grant 7,482,203 - Song , et al. January 27, 2 | 2009-01-27 |
Stackable Package by Using Internal Stacking Modules
App 20090001540 - YANG; JoungIn ; et al. | 2009-01-01 |
Stacked integrated circuit package-in-package system
App 20080105965 - Song; Sungmin ; et al. | 2008-05-08 |
Stacked integrated circuit package-in-package system
Grant 7,312,519 - Song , et al. December 25, 2 | 2007-12-25 |
Stacked integrated circuit package-in-package system with recessed spacer
Grant 7,298,037 - Yim , et al. November 20, 2 | 2007-11-20 |
Stacked Integrated Circuit Package-in-package System With Recessed Spacer
App 20070194423 - Yim; Choong Bin ; et al. | 2007-08-23 |
Stacked integrated circuit package-in-package system
App 20070158810 - Song; Sungmin ; et al. | 2007-07-12 |
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