Yang; John Jaekoyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; John Jaekoyun.The latest application filed is for "enhanced planarization liftoff structure and method for making the same".

Company Profile

0.9.9

Yang; John Jaekoyun - San Ramon CA
Yang; John Jaekoyun - Newark CA
Yang; John Jaekoyun - Pinole CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Enhanced planarization liftoff structure and method for making the same Grant 7,813,080 - Lille , et al. October 12, 2	2010-10-12
Lapping of gold pads in a liquid medium for work hardening the surface of the pads Grant 7,538,035 - Dunham , et al. May 26, 2	2009-05-26
Enhanced planarization liftoff structure and method for making the same App 20080151422 - Lille; Jeffrey S. ; et al.	2008-06-26
System and method for cleaning chemistry and processing during thin film magnetic head wafer fabrication Grant 7,374,621 - Guthrie , et al. May 20, 2	2008-05-20
Bilayer coil insulation for magnetic write heads to minimize pole recession Grant 7,292,408 - Chiu , et al. November 6, 2	2007-11-06
One step copper damascene CMP process and slurry Grant 7,287,314 - Guthrie , et al. October 30, 2	2007-10-30
System and method for cleaning chemistry and processing during thin film magnetic head wafer fabrication App 20070181151 - Guthrie; Hung-Chin ; et al.	2007-08-09
Gentle chemical mechanical polishing (CMP) liftoff process Grant 7,220,167 - Feng , et al. May 22, 2	2007-05-22
CMP process metrology test structures Grant 7,186,574 - Dulay , et al. March 6, 2	2007-03-06
CMP for corrosion-free CoFe elements for magnetic heads Grant 7,144,518 - Bergevin , et al. December 5, 2	2006-12-05
Lapping of gold pads in a liquid medium for work hardening the surface of the pads App 20060211247 - Dunham; Ronald ; et al.	2006-09-21
Gentle chemical mechanical polishing (CMP) liftoff process App 20060154573 - Feng; Jian-Huei ; et al.	2006-07-13
Magnetic recording heads having thin thermally conductive undercoating Grant 7,035,047 - Hsiao , et al. April 25, 2	2006-04-25
CMP process metrology test structures App 20060068511 - Dulay; Sukhbir Singh ; et al.	2006-03-30
Bilayer coil insulation for magnetic write heads to minimize pole recession App 20060023351 - Chiu; Andrew ; et al.	2006-02-02
One step copper damascene CMP process and slurry App 20050189319 - Guthrie, Hung-Chin ; et al.	2005-09-01
CMP for corrosion-free CoFe elements for magnetic heads App 20050127027 - Bergevin, Christopher W. ; et al.	2005-06-16
Magnetic recording heads having thin thermally conductive undercoating App 20040070870 - Hsiao, Wen-Chien ; et al.	2004-04-15

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.