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Patent applications and USPTO patent grants for Yang; Jiun-Chan.The latest application filed is for "methods of forming substrate interconnect structures for enhanced thin seed conduction".
Patent | Date |
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Methods Of Forming Substrate Interconnect Structures For Enhanced Thin Seed Conduction App 20200402921 - Jezewski; Christopher J. ;   et al. | 2020-12-24 |
Compact electrochemical bifunctional NO.sub.x/O.sub.2 sensors with internal reference for high temperature applications Grant 8,012,323 - Singh , et al. September 6, 2 | 2011-09-06 |
COMPACT ELECTROCHEMICAL BIFUNCTIONAL NOx/O2 SENSORS WITH INTERNAL REFERENCE FOR HIGH TEMPERATURE APPLICATIONS App 20090288961 - Singh; Dileep ;   et al. | 2009-11-26 |
High temperature total NO.sub.x sensor Grant 7,611,613 - Dutta , et al. November 3, 2 | 2009-11-03 |
Nox Sensor With Improved Selectivity And Sensitivity App 20090026076 - Yang; Jiun-Chan | 2009-01-29 |
High temperature total NOx sensor App 20070029210 - Dutta; Prabir K. ;   et al. | 2007-02-08 |
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