YANG; Jin-Feng

Patent Applications and Registrations

Patent applications and USPTO patent grants for YANG; Jin-Feng.The latest application filed is for "substrate structures, methods for forming the same and semiconductor device structures comprising the same".

Company Profile

8.10.11

YANG; Jin-Feng - Kaohsiung TW
Yang; Jin-Feng - Kaohsiung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate Structures, Methods For Forming The Same And Semiconductor Device Structures Comprising The Same App 20220084926 - HU; Ian ; et al.	2022-03-17
Semiconductor package Grant 11,075,186 - Hu , et al. July 27, 2	2021-07-27
Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor die Grant 11,024,557 - Chen , et al. June 1, 2	2021-06-01
Semiconductor package structure and method for manufacturing the same Grant 10,840,219 - Chen , et al. November 17, 2	2020-11-17
Semiconductor device package Grant 10,770,369 - Hung , et al. Sep	2020-09-08
Semiconductor Package Structure App 20200091036 - CHEN; Hsin-En ; et al.	2020-03-19
Semiconductor Device Package App 20200066612 - HUNG; Chih-Pin ; et al.	2020-02-27
Semiconductor Package Structure And Method For Manufacturing The Same App 20190287947 - CHEN; Bo-Syun ; et al.	2019-09-19
Semiconductor device package and method for manufacturing the same Grant 10,410,942 - Chen , et al. Sept	2019-09-10
Semiconductor package structure and method for manufacturing the same Grant 10,332,862 - Chen , et al.	2019-06-25
Semiconductor Device Package And Method For Manufacturing The Same App 20190164859 - CHEN; Tsan-Hsien ; et al.	2019-05-30
Semiconductor Package Structure And Method For Manufacturing The Same App 20190074264 - CHEN; Bo-Syun ; et al.	2019-03-07
Semiconductor Package App 20180226320 - HU; Ian ; et al.	2018-08-09
Semiconductor packages with thermal-enhanced conformal shielding and related methods Grant 9,984,983 - Chung , et al. May 29, 2	2018-05-29
Semiconductor Packages With Thermal-enhanced Conformal Shielding And Related Methods App 20170012007 - Chung; Chi-Sheng ; et al.	2017-01-12
Semiconductor packages with thermal-enhanced conformal shielding and related methods Grant 9,484,313 - Chung , et al. November 1, 2	2016-11-01
Semiconductor Packages With Thermal-enhanced Conformal Shielding And Related Methods App 20140239464 - Chung; Chi-Sheng ; et al.	2014-08-28
Semiconductor packages with thermal dissipation structures and EMI shielding Grant 8,704,341 - Lin , et al. April 22, 2	2014-04-22
Semiconductor Packages With Thermal Dissipation Structures And Emi Shielding App 20130307128 - Lin; I-Chia ; et al.	2013-11-21

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