Yang; Jeom-Sik
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yang; Jeom-Sik.The latest application filed is for "method of forming copper film on mo/sus flexible substrate".
- Yang; Jeom-Sik - Seoul KR
- Yang, Jeom-Sik - Seo-gu KR
| Patent | Date |
|---|---|
| Method of forming copper film on Mo/SUS flexible substrate Grant 9,281,094 - Lee , et al. March 8, 2 | 2016-03-08 |
| Method Of Forming Copper Film On Mo/sus Flexible Substrate App 20140295211 - Lee; Chi-Woo ; et al. | 2014-10-02 |
| Electrolyte solution for manufacturing electrolytic copper foil and electrolytic copper foil manufacturing method using the same App 20040104117 - Yang, Jeom-Sik ; et al. | 2004-06-03 |
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