Yang; Jeng-Huei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yang; Jeng-Huei.The latest application filed is for "method of processing semiconductor substrate".
- Yang; Jeng-Huei - Taichung TW
- YANG; Jeng-Huei - Taichung City TW
| Patent | Date |
|---|---|
| Method of processing semiconductor substrate Grant 11,107,671 - Hsu , et al. August 31, 2 | 2021-08-31 |
| Method Of Processing Semiconductor Substrate App 20190252181 - HSU; Wei-Chih ; et al. | 2019-08-15 |
| Apparatus of processing semiconductor substrate Grant 10,269,557 - Hsu , et al. | 2019-04-23 |
| Apparatus Of Processing Semiconductor Substrate App 20170110315 - HSU; Wei-Chih ; et al. | 2017-04-20 |
| Formation of prescribed pattern on wafer for use in SEM defect offset Grant 8,208,714 - Liu , et al. June 26, 2 | 2012-06-26 |
| Formation Of Prescribed Pattern On Wafer For Use In Sem Defect Offset App 20100296722 - LIU; Mu-Chieh ; et al. | 2010-11-25 |
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