Yang; Hung-Chou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Hung-Chou.The latest application filed is for "semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same".

Company Profile

0.3.4

Yang; Hung-Chou - Hsinchu County TW
Yang; Hung-Chou - Hsinchu County 302 TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same Grant 8,748,209 - Wang , et al. June 10, 2	2014-06-10
Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same Grant 8,053,904 - Wang , et al. November 8, 2	2011-11-08
Semiconductor Chip Package Structure For Achieving Flip-chip Type Electrical Connection Without Using Wire-bonding Process And Method For Making The Same App 20110229991 - WANG; BILY ; et al.	2011-09-22
Semiconductor Chip Package Structure For Achieving Electrical Connection Without Using Wire-bonding Process And Method For Making The Same App 20110018018 - WANG; BILY ; et al.	2011-01-27
Semiconductor Chip Package Structure For Achieving Flip-chip Type Electrical Connection Without Using Wire-bonding Process And Method For Making The Same App 20110018019 - WANG; BILY ; et al.	2011-01-27
Semiconductor Chip Package Structure For Achieving Electrical Connection Without Using A Wire-bonding Process And Method For Making The Same App 20090206465 - WANG; BILY ; et al.	2009-08-20

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