Yang; Hsueh-An

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Hsueh-An.The latest application filed is for "method of making a semiconductor device package".

Company Profile

0.22.24

Yang; Hsueh-An - Taipei TW
Yang; Hsueh-An - Taipei City TW
Yang; Hsueh-An - Kaohsiung TW
Yang; Hsueh-An - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of making a semiconductor device package with dummy gate Grant 9,502,334 - Yang November 22, 2	2016-11-22
Method Of Making A Semiconductor Device Package App 20160133546 - Yang; Hsueh-An	2016-05-12
Method of making a semiconductor device package Grant 9,240,348 - Yang January 19, 2	2016-01-19
Method of forming a bond ring for a first and second substrate Grant 9,056,766 - Cheng , et al. June 16, 2	2015-06-16
Method Of Making A Semiconductor Device Package App 20140363968 - YANG; Hsueh-An	2014-12-11
Method Of Forming A Bond Ring For A First And Second Substrate App 20140357007 - Cheng; Chun-Wen ; et al.	2014-12-04
Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substrates Grant 8,836,116 - Yang September 16, 2	2014-09-16
Bond ring for a first and second substrate Grant 8,810,027 - Cheng , et al. August 19, 2	2014-08-19
MEMS device etch stop Grant 8,633,554 - Chu , et al. January 21, 2	2014-01-21
Mems Device Etch Stop App 20130140653 - Chu; Chia-Hua ; et al.	2013-06-06
Silicon Chip Having Through Via and Method for Making the Same App 20130032889 - Yang; Hsueh-An ; et al.	2013-02-07
MEMS device etch stop Grant 8,368,152 - Chu , et al. February 5, 2	2013-02-05
Integration manufacturing process for MEMS device Grant 8,318,511 - Wu , et al. November 27, 2	2012-11-27
Mems Device Etch Stop App 20120261830 - Chu; Chia-Hua ; et al.	2012-10-18
Magnetic element and manufacturing method therefor Grant 8,277,667 - Yang , et al. October 2, 2	2012-10-02
Silicon chip having through via and method for making the same Grant 8,263,493 - Yang , et al. September 11, 2	2012-09-11
Integration Manufacturing Process For Mems Device App 20120111096 - Wu; Mingching ; et al.	2012-05-10
Wafer Level Packaging Of Micro-electro-mechanical Systems (mems) And Complementary Metal-oxide-semiconductor (cmos) Substrates App 20120098122 - YANG; Hsueh-An	2012-04-26
Bond Ring For A First And Second Substrate App 20120074554 - Cheng; Chun-Wen ; et al.	2012-03-29
Integration manufacturing process for MEMS device Grant 8,114,699 - Wu , et al. February 14, 2	2012-02-14
Integration manufacturing process for MEMS device Grant 8,030,111 - Wu , et al. October 4, 2	2011-10-04
Integration Manufacturing Process For Mems Device App 20110174058 - Wu; Mingching ; et al.	2011-07-21
Microelectromechanical microphone packaging system Grant 7,945,062 - Wang , et al. May 17, 2	2011-05-17
Method for manufacturing a device having a high aspect ratio via Grant 7,863,181 - Yang , et al. January 4, 2	2011-01-04
Silicon Chip Having Through Via and Method for Making the Same App 20100230759 - Yang; Hsueh-An ; et al.	2010-09-16
Micro-electro-mechanical-system package and method for manufacturing the same Grant 7,706,149 - Yang , et al. April 27, 2	2010-04-27
Method for manufacturing electric connections in wafer Grant 7,681,779 - Yang March 23, 2	2010-03-23
Wafer lever fixture and method for packaging micro-electro-mechanical-system devices Grant 7,651,888 - Yang January 26, 2	2010-01-26
Wafer Lever Fixture And Method For Packaging Micro-electro-mechanical-system Devices App 20090215228 - YANG; Hsueh An	2009-08-27
Integration Manufacturing Process For Mems Device App 20090075406 - Wu; Mingching ; et al.	2009-03-19
Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same Grant 7,501,342 - Wang , et al. March 10, 2	2009-03-10
Micro-electro-mechanical-system Package And Method For Manufacturing The Same App 20090046436 - YANG; Hsueh An ; et al.	2009-02-19
Method For Manufacturing A Device Having A High Aspect Ratio Via App 20090047782 - YANG; Hsueh An ; et al.	2009-02-19
Magnetic Element And Manufacturing Method Therefor App 20090047527 - Yang; Hsueh-An ; et al.	2009-02-19
Device Having High Aspect-ratio Via Structure In Low-dielectric Material And Method For Manufacturing The Same App 20080303167 - WANG; Wei Chung ; et al.	2008-12-11
Method For Manufacturing Electric Connections In Wafer App 20080230587 - Yang; Hsueh An	2008-09-25
Driving Method For Magnetic Element App 20080197951 - YANG; Hsueh-An ; et al.	2008-08-21
Method For Manufacturing A Semiconductor Package Structure Having Micro-electro-mechanical Systems App 20080188026 - Wang; Meng-Jen ; et al.	2008-08-07
Microelectromechanical microphone packaging system App 20070205499 - Wang; Wei-Chung ; et al.	2007-09-06
Two-axis device and manufacturing method therefor Grant 7,196,449 - Wu , et al. March 27, 2	2007-03-27
Integration manufacturing process for MEMS device App 20050280116 - Wu, Mingching ; et al.	2005-12-22
Two-axis device and manufacturing method therefor App 20050280331 - Wu, Mingching ; et al.	2005-12-22

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