loadpatents
name:-0.0063540935516357
name:-0.0048270225524902
name:-0.00054407119750977
Yang; Hsiu-Ju Patent Filings

Yang; Hsiu-Ju

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Hsiu-Ju.The latest application filed is for "laser package structure".

Company Profile
0.6.5
  • Yang; Hsiu-Ju - Hsinchu TW
  • Yang; Hsiu Ju - Tai Chung N/A TW
  • Yang; Hsiu-Ju - Taichung TW
  • YANG; Hsiu Ju - Tai Chung City TW
  • YANG; HSIU-JU - TAICHUNG CITY TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Laser Package Structure
App 20220085571 - Chen; Shou-Lung ;   et al.
2022-03-17
Package Structure
App 20210273403 - YANG; Hsiu-Ju ;   et al.
2021-09-02
Induction heating cooker and control circuit therefor
Grant 9,313,830 - Gong , et al. April 12, 2
2016-04-12
Induction heating cooker and control circuit therefor
Grant 8,476,563 - Gong , et al. July 2, 2
2013-07-02
Sensing method and circuit for a capacitive touch panel
Grant 8,378,987 - Huang , et al. February 19, 2
2013-02-19
Induction Heating Cooker And Control Circuit Therefor
App 20130008892 - GONG; Pei-Min ;   et al.
2013-01-10
Sensing Method And Circuit For A Capacitive Touch Panel
App 20110012862 - HUANG; CHUN-CHUNG ;   et al.
2011-01-20
Induction Heating Cooker And Control Circuit Therefor
App 20090173732 - GONG; Pei-Min ;   et al.
2009-07-09

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